Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Real Time with... SMTAI 2023: Underfilm: The New 20-Year-Old Assembly Solution
October 17, 2023 | Real Time with...SMTAIEstimated reading time: 1 minute
Underfilm is an alternative for underfill. Alltemated holds a patent for this technology which they've been perfecting for 20 years. Rachael Temple, sales and marketing, explains how it works, when to use it, and why you should.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in