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The October 2023 Issue of PCB007 Magazine Has Launched
October 18, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
High-reliability Fabrication
In this month’s issue of PCB007 Magazine, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication. We also detail the tradeoffs involved in maximizing reliability while reducing your costs and introduce you to experts and resources that can help you raise your reliability levels.
High-reliability fabrication presents a number of challenges and tradeoffs for fabricators, along with a myriad of market opportunities. What do we mean by high reliability? How much investment does it take for a traditional board shop to move into the ‘high-rel’ realm? How do you measure reliability failure? And after four years of research, why can’t the North American fab industry figure out the root cause of microvia failures?
Preview this month's issue or download a copy to your library for future reference.
Suggested Items
The Effects of Copper on a Transmission Line
12/23/2024 | Todd Kolmodin, Gardien ServicesAs technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor
12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System
11/19/2024 | Gen3GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions.