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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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The October 2023 Issue of PCB007 Magazine Has Launched
October 18, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
High-reliability Fabrication
In this month’s issue of PCB007 Magazine, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication. We also detail the tradeoffs involved in maximizing reliability while reducing your costs and introduce you to experts and resources that can help you raise your reliability levels.
High-reliability fabrication presents a number of challenges and tradeoffs for fabricators, along with a myriad of market opportunities. What do we mean by high reliability? How much investment does it take for a traditional board shop to move into the ‘high-rel’ realm? How do you measure reliability failure? And after four years of research, why can’t the North American fab industry figure out the root cause of microvia failures?
Preview this month's issue or download a copy to your library for future reference.
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SMTA Announces 2026 STAR Forum Technical Program
04/16/2026 | SMTAThe SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 6-7, 2026 in Olathe, Kansas, USA.
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
Federal Electronics’ Hermosillo Facility Passes ISO 9001 and AS9100 Audit with Zero Findings
04/09/2026 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, announced that its Hermosillo, Sonora, Mexico facility has successfully completed its latest ISO 9001 and AS9100 surveillance audit with outstanding results: zero major or minor non-conformances and zero observations.
Magnalytix Taps Metal Etch Services as Trusted Stencil Supplier for OE in a Box Kits
04/07/2026 | MagnalytixMagnalytix, providing real-time reliability solutions for electronics manufacturing, has chosen Metal Etch Services, Inc. as its stencil partner for OE in a Box kits.