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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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The October 2023 Issue of PCB007 Magazine Has Launched
October 18, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
High-reliability Fabrication
In this month’s issue of PCB007 Magazine, our expert contributors discuss the latest in technologies, trends, complexities and resources regarding high-reliability fabrication. We also detail the tradeoffs involved in maximizing reliability while reducing your costs and introduce you to experts and resources that can help you raise your reliability levels.
High-reliability fabrication presents a number of challenges and tradeoffs for fabricators, along with a myriad of market opportunities. What do we mean by high reliability? How much investment does it take for a traditional board shop to move into the ‘high-rel’ realm? How do you measure reliability failure? And after four years of research, why can’t the North American fab industry figure out the root cause of microvia failures?
Preview this month's issue or download a copy to your library for future reference.
Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
05/01/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
04/22/2025 | MicrochipThe JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.