Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2
It’s Only Common Sense: Stop Watching the Headlines and Start Watching the Opportunity
The Right Approach: The Pros and Cons of PCB Vertical Integration
A workshop sponsored by iNEMI and ZESTRON Corporation will be held on November 7, 2023 at 9:00 a.m.-5:00 p.m.
This full-day workshop brings together industry-based and academic researchers to talk about the challenges of advanced packaging and its intersection with high-frequency (mmWave) materials. The morning session focuses on heterogeneous integration and the latest materials and processes for electronics packaging, and the afternoon session will cover highlights from the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). Part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap program, MAESTRO is focused on creating a foundation of knowledge and expertise in the U.S. to support the development and manufacture of leading edge 5G and 6G products.
The workshop will be hosted by ZESTRON Americas in their Manassas, Virginia, facility and features speakers from
- Ajinomoto USA
- Florida International University
- Georgia Institute of Technology
- Intel
- iNEMI
- NIST
- Mosaic
- Penn State University
- SunRay Scientific
- ZESTRON
