Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
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Hentec Industries/RPS Automation Publishes the Critical Role of RHSD Processing for High-Reliability Applications Tech Paper
October 18, 2023 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing hot solder dip processing. This technical paper encompasses critically important information about component solder dip processing and is entitled “The Critical Role of Robotic Hot Solder Dip Processing of Components for High-Reliability and Mission-Critical Applications.” This 8-page tech paper outlines essential information to guarantee dependable circuit board assembly and can be downloaded by visiting HENTEC/RPS website.
Topics covered within this publication include gold embrittlement, gold removal, tin whisker mitigation, BGA component de-balling and component lead tinning. The robotic hot solder processing method as well as solderability testing are described in detail as well as the reasons behind the need to perform these protocols to ensure robust and reliable solder joints.
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