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Hentec Industries/RPS Automation Publishes the Critical Role of RHSD Processing for High-Reliability Applications Tech Paper
October 18, 2023 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing hot solder dip processing. This technical paper encompasses critically important information about component solder dip processing and is entitled “The Critical Role of Robotic Hot Solder Dip Processing of Components for High-Reliability and Mission-Critical Applications.” This 8-page tech paper outlines essential information to guarantee dependable circuit board assembly and can be downloaded by visiting HENTEC/RPS website.
Topics covered within this publication include gold embrittlement, gold removal, tin whisker mitigation, BGA component de-balling and component lead tinning. The robotic hot solder processing method as well as solderability testing are described in detail as well as the reasons behind the need to perform these protocols to ensure robust and reliable solder joints.
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Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).
Technica USA and Electra Polymers: Driving Success in Ink Jet Solder Mask Across North America
02/27/2025 | Technica USATechnica and Electra Polymers have achieved remarkable success in the ink jet solder mask market. Electra Polymers is the dominant force in North America, holding an overwhelming market share north of 80% with its ElectraJet® EMJ110 solder mask.