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IPC Global Standards Driving Factory of the Future

03/10/2025 | Chris Jorgensen, IPC
Factory of the Future represents a revolutionary shift in electronics manufacturing, aligning the industry's processes with the demands of efficiency, innovation, and sustainability. With challenges such as rapid product lifecycles, stringent quality requirements, and increasing emphasis on environmental responsibility, stakeholders across the supply chain—OEMs, EMS providers, and PCB manufacturers—face mounting pressure to modernize their operations.

Altus Enhances Traceability for Leading CEM

03/04/2025 | Altus Group
Altus Group, a leading supplier of capital equipment for the electronics industry, has helped Active PCB Solutions, a UK-based Contract Electronics Manufacturer, enhance its traceability with the installation of the YJ Link YLM Laser Marker.

Fresh PCB Concepts: Traceability in PCB Design

02/20/2025 | Team NCAB -- Column: Fresh PCB Concepts
Traceability has evolved from a safety-critical need in PCB production to a valuable tool across all electronic manufacturing industry sectors. The IPC-1782 standard addresses automated data collection, reduces ownership costs, and ensures accurate, timely information. It provides a flexible data architecture for different levels of traceability, from highly detailed systems (e.g., critical safety systems) to basic traceability needs (e.g., consumer products). The structure avoids data duplication and allows crucial information to be added post-production.

Incap India Invests in New SMT Technology

01/24/2025 | Incap
Incap India has invested approximately EUR 1 million in a new SMT (surface-mount technology) production line at its third factory in Tumkur.

The Pulse: Ultra Upgrade Unknowns—What’s Coming for UHDI?

01/21/2025 | Martyn Gaudion -- Column: The Pulse
As we enter the second quarter of the 21st century, there appears to be a new chapter in PCB technology. Ultra high density interconnect (UHDI) has become a buzzword, but it’s actually not that new; many of the processes were already established in the high-volume production of Asian cell phones and tablets. What is new and challenging, however, is migrating the line widths and stackups—once the domain of handheld consumer products—into the lower volume specialized environment of the commercial world.
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