- smt007 Magazine
Latest IssuesCurrent Issue
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
This issue takes stock of the current economic outlook and how companies are using current conditions to move themselves through technological evolutions, workforce shifts, and financial changes. Even with these headwinds, there’s forward progress to be made.
- Events||| MENU
- smt007 Magazine
New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics EcosystemOctober 20, 2023 | IPC
Estimated reading time: 1 minute
IPC, in collaboration with other industry organizations and representatives from academia and government celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap.
The MAPT Roadmap extends the work of SRC’s and Semiconductor Industry Association’s (SIA) 2030 Decadal Plan for Semiconductors. The Decadal Plan identified five seismic shifts in the industry related to smart sensing, memory and storage, communication, security, and energy efficient computing. The MAPT Roadmap summarizes the key drivers of technology progress, provides guidance for how to achieve the technical challenges outlined in the Decadal Plan, and strategizes for developing the workforce required to realize the promises of these innovations. These advances build upon breakthroughs in advanced packaging, 3D monolithic and 2.5D/3D heterogeneous integration, electronic design automation, analog and mixed signal processing, nanoscale manufacturing, new materials, photonics and MEMS integration, and energy-efficient computing.
SRC Chief Scientist and Director of the MAPT Roadmap, Dr. Victor Zhirnov, commented, “The commitment demonstrated by such a wide array of scientists, engineers, and researchers to the development and production of the MAPT Roadmap indicates the importance of such an effort.”
The MAPT Roadmap is framed around fundamental and practical limits of information and communications technology sustainability: energy, environmental, and workforce sustainability. SRC has been and continues to be a tremendous resource for semiconductor R&D and workforce development. The MAPT Roadmap directly supports the CHIPS and Science Act, led by the U.S. Department of Commerce, in efforts to develop a robust domestic ecosystem,” remarked Dr. Todd Younkin, president and CEO of SRC.
Added Matt Kelly, IPC chief technology officer and vice president of technology solutions and co-chair of roadmap chapter 8 committee on materials, substrates, and supply chain, “The MAPT Roadmap, a critically important effort, will guide the next decade of microelectronic needs and advancements. As the U.S. electronics sector faces significant challenges within the global market, it is crucial to develop strategies that foster growth, innovation, and competitiveness across this vital global industry – this roadmap provides this vision.”
The broad utilization of the IEEE International Roadmap for Devices and Systems (IRDS) is influencing the various Chips Acts worldwide. Initiatives in Europe, Japan, and the US are engaging the IRDS roadmap for guidance as their activities develop, said Tom Coughlin, President of IEEE. As part of the ongoing roadmap work, the most recent IRDS publication, the IRDS 2023 Update, is being published online and available publicly.
In the UAE Year of Sustainability, and at the 3rd ICAO Conference on Aviation and Alternative Fuels (CAAF/3) was held in Dubai, eight founding entities announced the launch of the “Air-CRAFT” initiative - a UAE based research consortium focused on developing, producing, and scaling sustainable aviation fuel (SAF) technologies.
A workshop sponsored by iNEMI and ZESTRON Corporation will be held on November 7, 2023 at 9:00 a.m.-5:00 p.m.
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is proud to co-sponsor the upcoming workshop, "Advanced Packaging and its Impact on mm/Wave Applications," in collaboration with the International Electronics Manufacturing Initiative (iNEMI).
This week’s editor’s picks come from the top end of reader interest, so I don’t think it’s just me who’s sensing this kind of momentum. For example, we bring you a site visit to one of the newest PCB fabs in North America, and a captive facility at that. Nokia is now manufacturing sophisticated telecom optical components in the United States, and iNEMI publishes a roadmap assisting in specifying the right low-loss material for your particular application, among other topics. To wrap it up, we get NASA news that reminds us that we need not be a big corporation to participate in space programs.