The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem
October 20, 2023 | IPCEstimated reading time: 1 minute
IPC, in collaboration with other industry organizations and representatives from academia and government celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap.
The MAPT Roadmap extends the work of SRC’s and Semiconductor Industry Association’s (SIA) 2030 Decadal Plan for Semiconductors. The Decadal Plan identified five seismic shifts in the industry related to smart sensing, memory and storage, communication, security, and energy efficient computing. The MAPT Roadmap summarizes the key drivers of technology progress, provides guidance for how to achieve the technical challenges outlined in the Decadal Plan, and strategizes for developing the workforce required to realize the promises of these innovations. These advances build upon breakthroughs in advanced packaging, 3D monolithic and 2.5D/3D heterogeneous integration, electronic design automation, analog and mixed signal processing, nanoscale manufacturing, new materials, photonics and MEMS integration, and energy-efficient computing.
SRC Chief Scientist and Director of the MAPT Roadmap, Dr. Victor Zhirnov, commented, “The commitment demonstrated by such a wide array of scientists, engineers, and researchers to the development and production of the MAPT Roadmap indicates the importance of such an effort.”
The MAPT Roadmap is framed around fundamental and practical limits of information and communications technology sustainability: energy, environmental, and workforce sustainability. SRC has been and continues to be a tremendous resource for semiconductor R&D and workforce development. The MAPT Roadmap directly supports the CHIPS and Science Act, led by the U.S. Department of Commerce, in efforts to develop a robust domestic ecosystem,” remarked Dr. Todd Younkin, president and CEO of SRC.
Added Matt Kelly, IPC chief technology officer and vice president of technology solutions and co-chair of roadmap chapter 8 committee on materials, substrates, and supply chain, “The MAPT Roadmap, a critically important effort, will guide the next decade of microelectronic needs and advancements. As the U.S. electronics sector faces significant challenges within the global market, it is crucial to develop strategies that foster growth, innovation, and competitiveness across this vital global industry – this roadmap provides this vision.”
Share on:
Suggested Items
The Chemical Connection: How We Deal With a Technology Roadmap
10/07/2024 | Don Ball -- Column: The Chemical ConnectionIdeally, we would all be aware of what future technology demands will be, at least for the near future, and take steps to be prepared to meet those demands. For most of us, however, while we may be aware of what’s coming in terms of production requirements, we usually don’t do much to get ready for them until we’re forced to by the market. We generally don’t have the time or personnel to spend on detailed planning or money to purchase any new equipment before it’s needed. So, how do most of us deal with it?
One World, One Industry: Mastering Technology Prognostication
09/18/2024 | John Mitchell -- Column: One World, One IndustryTechnological road mapping plays a fundamental role in many companies’ innovation strategies. While doing product development and organizational planning in the industry, I found roadmaps to be excellent tools for strategic and future planning. They are a crucial skill in today’s rapidly evolving tech landscape.
Marcy's Musings: Charting the Future
09/17/2024 | Marcy LaRont -- Column: Marcy's MusingsI’m sure we all remember the days when driving somewhere new meant pulling out our handy atlas, or writing down all the specific instructions on how to get there before we left on our trips. Now, modern navigation systems are so sophisticated that they talk you through the process, reroute when you make a wrong turn, and tell you exactly what time you’ll arrive. One of the most beneficial aspects of these maps is hearing your next required move before you get there so you don’t miss a turn or go in the wrong direction. Wouldn’t it be nice if our technology roadmaps did the same, helping prevent missteps and avoid hazards? But deciding where to go and how to get there is completely in our own hands, as is ensuring we actually take the twists and turns we have so carefully laid out in our roadmaps. Therein, I believe, lies the biggest challenge of all.
Technology Roadmaps: September 2024 Issue of PCB007 Magazine
09/16/2024 | I-Connect007 Editorial TeamIn this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to these all-important questions: What is my company’s technology roadmap? Is there anything so epic that it will change my business and/or my industry significantly in the near and distant future? What is driving the changes I will make in my facility? And most importantly, how will I implement this vision and reach the intended destination for my organization?
NextFlex Launches $5.3 Million Funding Opportunity to Strengthen U.S. Electronics Manufacturing and Promote Commercialization of Hybrid Electronics
06/10/2024 | BUSINESS WIRENextFlex, the Department of Defense (DoD) sponsored Manufacturing Innovation Institute focused on maturing hybrid electronics, today released Project Call 9.0 (PC 9.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing. The total PC 9.0 project value is expected to exceed $11M (including NextFlex investment and performer cost-share), bringing the total anticipated investment in advancing hybrid electronics since NextFlex’s formation to $143M.