Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
DELO: New Semicon Adhesive Propels Autonomous Driving Forward
October 20, 2023 | DELOEstimated reading time: 1 minute
DELO has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors. DELO DUALBOND BS3770 meets the stringent requirements of the semiconductor and automotive industries and helps drive innovation in autonomous driving.
The autonomous driving trend comes with ever-stricter safety requirements. Therefore, reliable components such as image sensors are installed in LiDAR and RADAR systems. Sensor housings on PCBs must be hermetically sealed throughout their entire service life in order to maintain their function permanently without interruption. However, previous solutions for hermetically sealing the housing and filter glass are reaching their limits due to these stricter requirements, failing to withstand the tests of the automotive industry, according to standard AEC-Q100.
DELO has developed DELO DUALBOND BS3770, a special electronics adhesive for semiconductor manufacturers to meet the demanding reliability and qualification tests of automotive suppliers.
Unlike adhesives previously available on the market, the newly developed adhesive is a flexible product with a Young's modulus of less than 5 MPa at room temperature. Due to its flexible properties starting from a temperature as low as approximately -50 °C, the adhesive can compensate for pressure changes that occur, such as those caused by temperature changes, humidity differences, or heat input in the reflow process during production. As a result, defects such as pop-ups or delamination do not occur, and the sensor is permanently protected.
DELO DUALBOND BS3770 can be precisely applied by needle dispensing while maintaining narrow and high bondlines. Curing takes place in two consecutive steps using UV light and heat. After dispensing, the adhesive is fixed in a few seconds by means of classic light fixation. Alternatively, it can be transferred to the B-stage, which is particularly relevant for bonding filter glasses with blackprint. At this stage, it achieves an initial adhesion comparable to tape. Afterwards, the second component can be joined. Thanks to the adhesive’s initial adhesion, the component is directly fixed so that it can be entirely processed further. Final curing takes place in a convection oven at +150 °C within 40 minutes.
In addition to image sensors for LiDAR and RADAR applications, DELO DUALBOND BS3770 is also used in driver monitoring and for 5G applications.
Share on:
Suggested Items
BIG, Delta Pioneer the First Low-Carbon Nitrogen in Thailand's Electronics Industry
12/23/2024 | Delta ElectronicsBIG, a climate technology company, and Delta Electronics (Thailand) Public Company Limited, a global leader in power management and IoT-based smart green solutions today announced a strategic partnership with BIG to advance the decarbonization of Thailand's electronics industry.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
12/25/2024 | Dan Beaulieu -- Column: Dan's Biz Bookshelf"Costovation" by Stephen Wunker and Jennifer Luo Law delivers a refreshing perspective on innovation by focusing on "just enough" innovation—creating products and services that serve the customer's needs without unnecessary features or costs. This book is a revelation for business leaders seeking effective strategies when flashy, expensive innovations often dominate the market. The authors share how companies can thrive by delivering targeted, cost-effective innovation by offering customers precisely what they need.
It’s Only Common Sense: Dear Santa, Here’s My Sales Wish List
12/23/2024 | Dan Beaulieu -- Column: It's Only Common SenseChristmas is coming, and every salesperson knows it’s not just time for eggnog and office parties, it’s the perfect time to ask Santa for a little extra something to boost their success in the coming year. Who better to help you hit your sales quota than the guy who delivers millions of packages overnight without missing a single chimney? Santa knows logistics, customer satisfaction, and how to work a tight deadline. So, what should a good salesperson ask of Santa for Christmas? Let’s look at the ultimate sales wish list with a little humor sprinkled in.