Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Koh Young Showing PCBA and Semiconductor Inspection Innovations at Productronica
October 23, 2023 | Koh YoungEstimated reading time: 4 minutes
Koh Young, the industry leader in True 3D measurement-based inspection solutions, will highlight live demonstrations of its award-winning inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica, the highly-anticipated trade fair in Messe München on November 14-17, 2023 in Munich, Germany. Koh Young will have two booths. The first is at A2.377 and is focused on traditional surface mount technology. Our sister booth at A2.359 is focused on advanced packaging and semiconductor inspection innovations. Join our booth at Productronica 2023 to find out more. The following is just a glimpse into what Koh Young will have in store for our visitors.
Solder Paste Inspection (SPI)
In 2002, we introduced the concept of 3D measurement-based solder paste inspection – and it revolutionized the inspection industry. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. The KY8030-3 is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing market. With a patented dual-projection technology, we deliver trustworthy and repeatable measurement data, which manufacturers can use to reliably optimize the print process.
1. KY8030-3 Industry’s Fastest True3D SPI Solution with Integrated Auto-Repair Dispenser
2. aSPIre3: Industry’s Highest Performing True3D SPI Solution
Automated Optical Inspection (AOI)
The Koh Young 3D AOI Zenith delivers perfect inspection performance with True3D measurement technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. At Koh Young, the Zenith measures all components in True3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board color variations. When our 3D measurement data meets artificial intelligence, we can deliver even more advantages to manufacturers.
3. Zenith Alpha Best Value True3D Automated Optical Inspection Solution
4. Zenith UHS Industry’s Fastest True3D AOI Solution
5. Zenith 2 Revolutionary True3D AOI Delivering Incomparable Capabilities
Automated Pin Inspection (API)
Built on its world-class True3D™ AOI technology, new enhancements help it break through barriers associated with inspecting products with a mix of both Pins and SMDs. The complete KY-P3 lineup provides an automated back-end solution combining advanced high-resolution optics and innovative AI-powered vision algorithms for single pin, press-fit, and Final Optical Inspection, as well as for pins inside a connector shroud, while also inspecting traditional SMDs on the same product. Because of its quantitative measurement-based approach, accuracy and repeatability is unsurpassed.
6. KY-P3 Industry-awarded breakthrough in 3D Automated Pin Inspection
Dispense Process Inspection (DPI)
The award-winning Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology (Laser Interferometry for Fluid Tomography), the Neptune delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent and translucent materials.
7. Neptune T Industry’s First 3D Optical Measurement Instrument for Transparent Materials
8. Neptune C+ Award-winning True3D In-Line Dispensing Process Inspection (DPI) Solution
Process Control & Optimization Software
AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes. Koh Young can help manufacturers solve significant business challenges by applying connectivity to modernize industry processes. By leveraging IPC-CFX with its AI-powered technologies, Koh Young successfully applies real-time data to improve the production process by converting data into process knowledge. Combined with IPC communication standards, Koh Young can open the gates to a smart factory for anyone.
9. KSMART Seamless Smart Factory Software Suite Turning Data into Insights
10. KPO Award-winning AI-powered Printer and mounter Process Optimization Software
Semiconductor and Advanced Packaging Inspection
Building on our award-winning, industry-leading inspection technologies, the Koh Young Meister Series delivers True 3D measurement-based inspection for ultra-thin solder, wafer bumps, balls, and components. Manufacturers can maximize yield without increasing costs by detecting defects at the wafer level with accurate inspection.
11. Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits
12. Meister D+ Breakthrough in 3D Measurement for Highly Reflective and Mirror-surfaced Components
13. Meister W+ True 3D Measurement for Wafer Bumps & Shiny Components
To learn more about how our solutions boost your quality, visit us at Productronica in Booths A2.377 and A2.359 at Messe München in Munich, Germany.
FREE downloads from Koh Young:
- The Printed Circuit Assembler's Guide to...SMT Inspection: Today, Tomorrow, and Beyond eBook
- The Companion Guide to…SMT Inspection: Today, Tomorrow, and Beyond eBook
- Why the Need for 3D Solder Paste Inspection article
- How Engineers Can Use SPI Tools for Verification article
- Testing Out an Expert Partnership: Stencil Printing in Cavities article
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.