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GenI Generative AOI Programming Debuts: Mycronic Sets a New Standard in AOI Automation
November 10, 2025 | MycronicEstimated reading time: 1 minute
Mycronic’s PCB Assembly Solution division announces the launch of GenI™, an industry first solution designed to liberate electronics manufacturers from the complexities of traditional Automated Optical Inspection (AOI) programming. GenI empowers users to introduce new products in just 10 minutes - compared to several hours with conventional AOI systems - without requiring any AOI programming skills.
GenI solves the core challenge of time-consuming AOI programming, offering true 3D metrology inspection and full measurement traceability. Mycronic is the only AOI supplier with direct access to pick-and-place programs, enabling full metrology inspection. With this new software solution, inspection reliability is no longer dependent on programmer skill or experience.
“GenI is more than a technical breakthrough—it’s a strategic leap for manufacturers and stakeholders alike. By removing the barriers of AOI programming and enabling rapid, reliable inspection, we’re empowering our customers to accelerate innovation and maximize operational efficiency,” said Alexia Vey, Product Manager Inspection, PCB Assembly Solutions.
Key Features
- Automatic AOI program generation: Complete setup in 10 minutes or less with CAD data from Mycronic pick-and-place - allowing inline AOI without production stoppage during new product introduction.
- AI-powered, library-free inspection: Eliminates the need for inspection libraries, ensuring consistent results regardless of programmer expertise.
- Inspection program based on first assembled board: No need for a golden or perfect board - GenI works with any first board, regardless of quality.
- Full metrology inspection: Offering inspection traceability.
GenI is the only solution on the market offering all-in-one zero programming, true 3D measurement, and traceability. Most solutions currently on the market focus solely on automatic program creation and retain library management; GenI covers every AOI programming step - from creation to fine-tuning for false call reduction. Inspection results are consistent, no matter who creates the AOI program.
“This launch strengthens Mycronic’s leadership in smart manufacturing and positions us for scalable, sustainable growth. GenI is not just shaping the future of electronics production - it’s creating new value for our customers and investors in a rapidly evolving market,” said Clemens Jargon, Sr VP, PCB Assembly Solutions.
Visit Mycronic at Productronica 2025 in Munich, Germany November 18-21 at booth A3.249 to experience live demos and to learn more about Mycronic’s GenI technology, full-line, and connectivity solutions that help PCB manufacturers flex their factory flow.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
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12/09/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, has been recognized with a Productronica Innovation Award for its breakthrough KPO solution.
Koh Young Highlighting 3D Inspection for Advanced Packaging at SEMICON Japan 2025 in Tokyo Big Sight
11/24/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, will showcase its latest semiconductor inspection portfolio at SEMICON Japan 2025, held from December 17 to 19 at Tokyo Big Sight in Booth E5528.
Merlin PCB Group Invests in 2 CIMS Galaxy 25µ AOI Machines
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Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
Koh Young Technology Appoints Jeff Lee as Head of Industrial Solutions Business
11/03/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head of Industrial Solutions Business.