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Advanced Electronics Packaging Digest

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BAE Systems Receives $16M to Qualify RH45® for Space Missions

09/17/2026 | PRNewswire
BAE Systems has received $16 million in Defense Production Act Title III funding via the Department of War's (DOW) Warfighting Investments, Resourcing, and Execution directorate to demonstrate and qualify its radiation-hardened 45 nanometer (nm) technology.

Trio-Tech Secures 3-Year Automotive Semiconductor Burn-In Contract Worth $4.7M Minimum

09/17/2026 | BUSINESS WIRE
Trio-Tech International , a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has secured a three-year production burn-in contract with a new automotive semiconductor customer across Europe and North America.

PCB Design Takes Center Stage at FED’s Design Awards

09/17/2026 | Marcy LaRont, I-Connect007
PCB designers often work behind the scenes, but their decisions can determine whether an electronic product succeeds in manufacturing. At the FED Annual Conference in Germany on Sept. 23, the PCB Design Award 2026 will put that work in the spotlight. Marcy LaRont interviewed FED Managing Director Christoph Bornhorn and board member Erika Reel about what makes a winning design, and how the profession is changing as AI, automation, and other technologies reshape electronics development.

TFE Acquires TEKENA USA, Expanding Particle Removal and Surface Cleaning Portfolio

09/16/2026 | TFE
TFE, a North American provider of manufacturing equipment, consumable products and technical solutions, announced the acquisition of TEKENA USA LLC, a provider of particle removal and surface cleaning technologies for precision manufacturing applications.

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

09/16/2026 | PRNewswire
Spirox, hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications.
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