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Indium Earns Mexico Technology Award for Low-Voiding, Pb-Free Solder Paste
October 25, 2023 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation has earned a Mexico Technology Award for its new low-voiding, Pb-free solder paste,
Indium8.9HFRV. The award was presented during an awards ceremony on October 25 at the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico.
“At Indium Corporation, we believe that materials science can change the world,” said Alfonso Herrera, Regional Sales Manager for Mexico. “We are honored to receive the Mexico Technology Award for Indium8.9HFRV for its exceptional low-voiding performance, excellent stencil print transfer efficiency, and response-to-pause performance.”
The Mexico Technology Awards are presented by Mexico EMS and recognize the very best new innovations in the printed circuit assembly and packaging industries during the past year.
A flux vehicle developed from the industry-leading Indium8.9HF chemistry, Indium8.9HFRV is a new air reflow, no-clean solder formulated to improve the voiding performance of next generation Pb-free high-reliability alloys. Applications requiring extended thermal cycling performance at higher temperatures may require suitable high-reliability alloys. Indium8.9HFRV is a superior choice for high-reliability alloys, providing both voiding mitigation performance and excellent electrical and process reliability. The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry for other applications.
Among its key features, Indium8.9HFRV offers:
- Low voiding
- High transfer efficiency through small apertures (≤0.66AR)
- Excellent wetting
- Outstanding response-to-pause performance
- Compatibility with both Air and N2 reflow environments
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