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AIM to Exhibit at Productronica Germany Trade Fair
October 31, 2023 | AIM SolderEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming Productronica 2023 Trade Fair taking place November 14-17 at Trade Fair Center Messe München, Germany.
AIM will highlight many of its innovative products, including halogen-free no clean solder paste H10. H10 offers exceptional fine feature printing, improved electrochemical reliability, transfer efficiency >90% on area ratios of 0.50, and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 also reduces voiding on BGA, BTC, and LGA. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.
In addition, expect some surprises, including a new, soon-to-be-announced product designed for ultra fine pitch printing.
To discover all of AIM’s products and services, visit the company at the Productronica Trade Fair, booth A3.339 November 14-17.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Advancing Photonic Soldering
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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