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OSI Systems President and CEO Deepak Chopra to Retire by Calendar Year-End, Will Remain as Executive Chairman

05/06/2024 | OSI Systems
OSI Systems, Inc. announced today that Chairman and Chief Executive Officer Deepak Chopra has informed the Company’s Board of Directors of his plans to retire from his roles as President and Chief Executive Officer by the end of the current calendar year, after the appointment of a successor.

IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?

05/06/2024 | IDTechEx
Future connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.

Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis

05/03/2024 | Altair
Altair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.

The Chemical Connection: Reducing Etch System Water Usage, Part 2

05/02/2024 | Don Ball -- Column: The Chemical Connection
In my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.

Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products

05/01/2024 | Real Time with...IPC APEX EXPO
Chris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
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