-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Seica to Exhibit at Productronica 2023
November 6, 2023 | SeicaEstimated reading time: 5 minutes

Accelerating innovation has always been a touchstone of Seica’s approach to providing solutions to the electronics industry, so visitors to Seica’s booth at Productronica 2023 will see full alignment with this year’s theme in the latest, leading-edge, completely automated test solutions on display in Booth A1-445 as well as the fully automated selective soldering and optical inspection solutions on show at the Seica Automation Booth A3-335.
The PILOT VX test platform on display in Booth A1-445, is the new gold standard in terms of flying probe speed and performance. New, state-of-the-art mechanical architecture and motion controllers enable a reduction of up to 50% in test time, 12 multi-function test heads provide the capability for double-side probing of up to 44 points simultaneously and technologically advanced measurement hardware and a new microwave-based measurement technique provide unrivaled test performance. Optimized VIVA software management saves even more time by enabling the parallelization of different types of tests, and smart analysis capabilities together, with algorithms based on the principles of artificial intelligence can automatically optimize the test flow in run-time, while maintaining test coverage targets. The FlyPod option extends testing capability even more by specializing a single mobile probe to carry up to 14 channels, enabling access to boundary scan circuits and adding onboard programming capability without any external fixed cables and the Pilot VX platform includes options for testing flex circuits and the electrical and optical test of LEDs. In addition, the Pilot VX can also generate pressure/force topology maps of the device under test using the innovative FlyStrain™ option. Once a necessity for traditional fixture-based solutions, Seica has migrated these new tools to the flying prober where testing of ceramics, wafers and avionics and satellite boards requires delicate probing and traceability.
The Pilot VX is a tremendously powerful asset, deployable in every phase of today’s accelerated product lifecycle, from concept, to design, to prototype, to production: the intrinsic capability of the Pilot VX flying prober to give immediate, extremely precise access to all of the points on a first prototype board, coupled with an extensive suite of measurement hardware and software tools, including the PR boost feature with the capability to power the board (up to 2A per probe) with all of the 8 standard electrical probes enables the test and validation of prototypes quickly and with minimum effort without requiring deep specific training on the tester or generating a test programs. Once the design has been validated, the automatic generation of a complete test program starting from the board CAD is a fast, streamlined process using SEICA’s VIVA software platform, minimizing the setup time for pre-series and/or full production test. In fact, the dramatic improvements in speed and performance achieved in the Pilot VX platform, has now made flying probe test a key solution in many high-volume production environments with a high level of automation.
Visitors to Seica’s booth will also see the fully automated COMPACT SL 4J NEXT>. Designed to maximize configurability and customization, the Compact SL satisfies the full range of test requirements: from in-circuit, to functional, to combinational, as well as performing other tasks such as onboard programming (OBP) and has the speed and flexibility to meet todays’ demanding throughput targets As part of Seica’s COMPACT line of test solutions, the COMPACT SL allows the user to choose the most suitable configuration for today’s need, while ensuring scalability for future requirements. The test solution on display includes the new ATE BOOSTER module, the latest addition to the vast suite of performances available, designed to maximize LED test capability and OBP performances, while reducing costs by means of innovative optimization of the hardware resources required.
Seica’s MINI Line, also on display, a very useful and cost-effective platform to develop your customized test benchmark, providing a wide range of integrated instruments, switching matrices and user power supplies and, unlike most self-manufactured “rack and stack” test beds, Seica’s MINI test solution has the standard “core” VIVA Integrated Platform (VIP™) with complete user documentation and a self-diagnostic program, guaranteeing sustainability and maintainability over time, even in the case of resource turnover. The user has broad discretion in the choice of configuration and programming languages: Seica’s VIVA Integrated Platform (VIP™) allows easy integration of off-the shelf instrumentation, and test sequences can be developed using the VIVA Test Studio environment as well as a wide range of third-party software including LabView©, TestStand©, C, and Python. Moreover, the programs developed on the MINI are completely transportable to other SEICA systems which makes for fast and easy setup of the manufacturing test process.
In Hall A3 visitors to Seica Automation ’s booth A3-335 will be able to view Seica’s innovative solutions for board manufacturers together with the other automation solutions on display.
The DRAGONFLY Next > provides optical inspection of THT components: the combination of multi-colored LED lighting and color scan camera enables detailed inspection of the solder joint meniscus and shorts detection, while the full scan acquisition of the PCB surface and not only of the components allows the detection of solder balls. The DRAGONFLY Next > series also includes the configuration for conformal coating inspection of finished products, as well as for process control and setup. Configurable for single and double sided inspection of the board, its intuitive and streamlined management software environment enables the user to develop and deploy an application program in a few hours.
The Firefly Next> is a technologically advanced automated selective soldering solution, with its perfect integration, on a single axis, of a high-efficiency LASER source, fully-programmable donut spot, vision system and temperature sensor. The Firefly redefines the levels of performance achievable in the selective soldering process in terms of flexibility, throughput, reliability, applicability and process traceability. The Firefly will be demonstrated in-line, using Seica Automation board handling modules and visitors will have the opportunity to see live demos of the soldering process directly at the booth.
All of the solutions on display include Seica’s VIVA NEXT software platform, which is able to provide intelligent integration with all aspects of the customer’s manufacturing processes - data collection, traceability, interaction with MES, repair operations – and all of the Next> series systems have Canavisia’s Industrial Monitoring solution on board, for remote monitoring of current and voltage consumption, mains supply, temperature, light indicators and other parameters useful to indicate correct operation, provide information for predictive maintenance and, in general, to render the systems compatible with today’s Industry 4.0 standards
Come visit us at Booth A1-445 and Booth A3-335 to see how our innovation can help accelerate yours.
Suggested Items
CIMS to Exhibit at JPCA Show 2025
05/28/2025 | CIMSCIMS is excited to announce our participation at JPCA 2025 in Tokyo, Japan! Join us from June 4-6.
Rohde & Schwarz Satellite Industry Day 2025: Connecting the World with New Space and 5G NTN Technologies
05/27/2025 | Rohde & SchwarzAfter four successful online events with over 1000 participants, Rohde & Schwarz is hosting its fifth Satellite Industry Day on June 3, 2025, on-site at its Munich campus. Rohde & Schwarz test and measurement experts and partners from the industry will present topics from 5G Non-Terresterial Network (NTN) and satellite testing to monitoring and regulatory issues. During breaks participants can experience cutting-edge test and measurement solutions.
Vertical Aerospace Makes Aviation History with Piloted eVTOL Flight in Open Airspace
05/27/2025 | BUSINESS WIREVertical Aerospace, a global aerospace and technology company that is pioneering electric aviation, announced it has made European aviation history with the first-ever piloted wingborne flight of a winged electric vertical take-off and landing (eVTOL) aircraft in open airspace.
TRI, Bosch Partner on AI Solution for MEMS Packaging
05/26/2025 | TRITest Research, Inc., the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.
QinetiQ’s LTPA Extension Worth £1.54B to Modernize Test & Evaluation for Future Warfare
05/26/2025 | QinetiQQinetiQ Group plcannounces a five-year, £1.54 billion extension to its Long Term Partnering Agreement (LTPA) with the UK’s Ministry of Defence (MOD) that will transform the provision of mission critical test and evaluation capabilities and services that help to enhance operational readiness of the UK and allied nations.