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I-Connect007 Welcomes Marcy LaRont to Editorial Team
November 6, 2023 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 is excited to welcome new Managing Editor Marcy LaRont to the editorial team.
Having begun her career in PCB manufacturing right out of college, Marcy has a broad base of business experience and manufacturing knowledge, from production control and supply chain to sales and marketing, strategic planning, and senior management. She has lived in both Taiwan and Hong Kong, even contributing as a guest editor for I-Connect007 during her last stint as an expatriate in Asia.
In her new role as managing editor of PCB007 Magazine, Marcy will apply her extensive industry and management experience to drive content and strategy, while leading the editorial department.
“We are thrilled to be working with Marcy again," says I-Connect007 Publisher Barry Matties. "Her knowledge and experience in our industry and around process and organizational management will further fortify our commitment to industry education and continuous improvement."
“I was fortunate to be a contributor at I-Connect007 many years ago," Marcy says. "It is amazing to see the company’s explosive growth while having maintained such a high-quality standard across all focused content areas and media steams. I am excited to again be a part of this dynamic and driven team!”
Marcy received her Bachelor of Arts degree from the University of California, Santa Cruz, and currently splits her time between Phoenix, Arizona, and the Bay Area, California. Wife, mother and grandmother, Marcy loves any place adjacent to water, prefers to be outside, if given a choice, and appreciates a hoppy IPA.
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Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology
11/22/2024 | Real Time with... electronicaMarcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production.
Inkjet Innovations and Environmental Leadership with Taiyo
05/22/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont catches up with John Fix from Taiyo America to discuss Taiyo's innovative products and strategic partnerships, including their development of new products to meet evolving industry standards such as SVHC free material and advancements in inkjet technology. They touch on the impact of automation and Taiyo’s AT100 robotic offering, as well as their expansion of direct employees in Europe to provide greater support to that region.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Paul Cooke of Ventec Talks About Glassless Revolution, High Reliability
04/09/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont from I-Connect007 caught up with Paul Cooke from Ventec at the SMTA UHDI Symposium on March 26 in Arizona. Paul discusses the challenges in developing future product lines for extremely high density, high reliability manufacturing, and focuses on the transition from glass to glassless substrate technology. He explains the advantages of using pure resin systems, enabling fabricators to create thinner materials for micro vias.
The World of Electronics and Standards: A Conversation with Frank Honyotski, STI
04/03/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont of I-Connect007 speaks with Frank Honyotski of STI Electronics, who discusses the services offered by STI, including training, engineering, and failure analysis. He highlights his involvement with IPC standards development and emphasizes the importance of industry professionals engaging in standards development.