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Real Time with... electronica 2024: Inside CEE PCB—Innovations in Technology

11/22/2024 | Real Time with... electronica
Marcy LaRont Interviews Tom Yang and Jerome Larez From CEE PCB. Tom and Jerome showcase the company's advancements and emphasize the importance of automation in PCB manufacturing for quality and efficiency. The CEE PCB focuses on sustainability and aims to connect with high-tech clients while exploring new partnerships for high-volume production.

Inkjet Innovations and Environmental Leadership with Taiyo

05/22/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont catches up with John Fix from Taiyo America to discuss Taiyo's innovative products and strategic partnerships, including their development of new products to meet evolving industry standards such as SVHC free material and advancements in inkjet technology. They touch on the impact of automation and Taiyo’s AT100 robotic offering, as well as their expansion of direct employees in Europe to provide greater support to that region.

D Coupon Testing and Data Insights With GreenSource Fabrication

04/17/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.

Paul Cooke of Ventec Talks About Glassless Revolution, High Reliability

04/09/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont from I-Connect007 caught up with Paul Cooke from Ventec at the SMTA UHDI Symposium on March 26 in Arizona. Paul discusses the challenges in developing future product lines for extremely high density, high reliability manufacturing, and focuses on the transition from glass to glassless substrate technology. He explains the advantages of using pure resin systems, enabling fabricators to create thinner materials for micro vias.

The World of Electronics and Standards: A Conversation with Frank Honyotski, STI

04/03/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont of I-Connect007 speaks with Frank Honyotski of STI Electronics, who discusses the services offered by STI, including training, engineering, and failure analysis. He highlights his involvement with IPC standards development and emphasizes the importance of industry professionals engaging in standards development.
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