Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Qualcomm Propels Global Expansion of 5G RedCap with Snapdragon X35 5G Modem-RF System
November 8, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
As the world’s first announced commercial release 17 5G RedCap modem-RF system, the Snapdragon® X35 5G Modem-RF System continues to fuel the expansion of the 5G ecosystem by enabling global mobile network operators and OEMs to enable new devices, form factors, and experiences.
With strong customer interest in the industry-leading Snapdragon X35 5G Modem-RF System for 5G RedCap devices, Qualcomm Technologies, Inc. is extending its wireless leadership – spanning modem, RF transceiver, RF front-end and antenna modules – into a fast-growing opportunity for 5G mobile operators. The Snapdragon X35 brings a new class of 5G that bridges the complexity gap between high-speed mobile broadband devices and extremely low-bandwidth internet of things (IoT) devices. RedCap will enable smaller and more cost-efficient 5G devices and provide longer battery life, thanks to their reduced complexity.
Numerous mobile industry leaders around the world have taken notice and are working with Qualcomm Technologies, Inc. to develop and deploy devices powered by Snapdragon X35.
“5G RedCap is one of the primary pillars of 5G Advanced and is key to the evolution of 5G. It bridges the capability and complexity gap between the extremes in 5G today, and can enable a broader set of devices and services as well as enhance system performance and efficiency,” said Gautam Sheoran, vice president and general manager, wireless and broadband communications, Qualcomm Technologies, Inc. “We’re pleased to deepen our collaboration with global mobile operators and OEMs to advance the 5G ecosystem, enabling a new and wide range of premium- and entry-level use cases.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
High-Tech Hill Technology Park Opens: Four New Factories Launched
09/26/2025 | TeltonikaThe ambitious vision announced in late 2020 to build a world-class technology park in Liepkalnis, Vilnius, has become a reality. AGP Investments, led by entrepreneur Arvydas Paukštys, together with high-tech leaders Teltonika and TLT, today inaugurated four new factories at the Vilnius High-Tech Hill Technology Park.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.