Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
American Made Advocacy: New Congress, New Opportunities
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Qualcomm Propels Global Expansion of 5G RedCap with Snapdragon X35 5G Modem-RF System
November 8, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
As the world’s first announced commercial release 17 5G RedCap modem-RF system, the Snapdragon® X35 5G Modem-RF System continues to fuel the expansion of the 5G ecosystem by enabling global mobile network operators and OEMs to enable new devices, form factors, and experiences.
With strong customer interest in the industry-leading Snapdragon X35 5G Modem-RF System for 5G RedCap devices, Qualcomm Technologies, Inc. is extending its wireless leadership – spanning modem, RF transceiver, RF front-end and antenna modules – into a fast-growing opportunity for 5G mobile operators. The Snapdragon X35 brings a new class of 5G that bridges the complexity gap between high-speed mobile broadband devices and extremely low-bandwidth internet of things (IoT) devices. RedCap will enable smaller and more cost-efficient 5G devices and provide longer battery life, thanks to their reduced complexity.
Numerous mobile industry leaders around the world have taken notice and are working with Qualcomm Technologies, Inc. to develop and deploy devices powered by Snapdragon X35.
“5G RedCap is one of the primary pillars of 5G Advanced and is key to the evolution of 5G. It bridges the capability and complexity gap between the extremes in 5G today, and can enable a broader set of devices and services as well as enhance system performance and efficiency,” said Gautam Sheoran, vice president and general manager, wireless and broadband communications, Qualcomm Technologies, Inc. “We’re pleased to deepen our collaboration with global mobile operators and OEMs to advance the 5G ecosystem, enabling a new and wide range of premium- and entry-level use cases.”
Share on:
Suggested Items
Würth Elektronik: Wi-Fi Module for IoT Security
03/11/2025 | Würth ElektronikWürth Elektronik introduces its new Cordelia-I Wi-Fi module, specifically designed for secure IoT and ‘edge computing’ applications. This versatile module is ideal for applications in Industry 4.0, Smart City / Smart Home, eMobility, smart agricultural, and medical devices, to name a few.
Thales Joins IMC to Strengthen IoT Security and Connectivity
03/10/2025 | ThalesThales has joined the IoT M2M Council (IMC), marking a significant step forward in our mission to enhance awareness around the vital importance of digital device connectivity and security.
KYZEN to Showcase MICRONOX MX2123 Power Module Cleaner at IMAPS Device Packaging Conference 2025
02/21/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 3-6 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ.
Cambridge GaN Devices Secures $32M to Drive Global Growth in Power Semiconductor Industry
02/18/2025 | BUSINESS WIRECambridge GaN Devices (CGD), a leading innovator in gallium nitride (GaN) power devices, has successfully closed a $32 million Series C funding round. The investment was led by a strategic investor with participation from British Patient Capital and supported by existing investors Parkwalk, BGF, Cambridge Innovation Capital (CIC), Foresight Group, and IQ Capital.
Worldwide Silicon Wafer Shipments and Revenue Start Recovery in Late 2024
02/13/2025 | SEMIIn the second half of 2024, worldwide silicon wafer demand started to recover from the industry downcycle seen in 2023, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.