-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Qualcomm Propels Global Expansion of 5G RedCap with Snapdragon X35 5G Modem-RF System
November 8, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
As the world’s first announced commercial release 17 5G RedCap modem-RF system, the Snapdragon® X35 5G Modem-RF System continues to fuel the expansion of the 5G ecosystem by enabling global mobile network operators and OEMs to enable new devices, form factors, and experiences.
With strong customer interest in the industry-leading Snapdragon X35 5G Modem-RF System for 5G RedCap devices, Qualcomm Technologies, Inc. is extending its wireless leadership – spanning modem, RF transceiver, RF front-end and antenna modules – into a fast-growing opportunity for 5G mobile operators. The Snapdragon X35 brings a new class of 5G that bridges the complexity gap between high-speed mobile broadband devices and extremely low-bandwidth internet of things (IoT) devices. RedCap will enable smaller and more cost-efficient 5G devices and provide longer battery life, thanks to their reduced complexity.
Numerous mobile industry leaders around the world have taken notice and are working with Qualcomm Technologies, Inc. to develop and deploy devices powered by Snapdragon X35.
“5G RedCap is one of the primary pillars of 5G Advanced and is key to the evolution of 5G. It bridges the capability and complexity gap between the extremes in 5G today, and can enable a broader set of devices and services as well as enhance system performance and efficiency,” said Gautam Sheoran, vice president and general manager, wireless and broadband communications, Qualcomm Technologies, Inc. “We’re pleased to deepen our collaboration with global mobile operators and OEMs to advance the 5G ecosystem, enabling a new and wide range of premium- and entry-level use cases.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Semiconductors Get Magnetic Boost with New Method from UCLA Researchers
07/31/2025 | UCLA NewsroomA new method for combining magnetic elements with semiconductors — which are vital materials for computers and other electronic devices — was unveiled by a research team led by the California NanoSystems Institute at UCLA.
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem
06/24/2025 | PRNewswireIn 2024, the global market size of Dry Film Photoresist was estimated to be worth US$939 million and is forecast to reach approximately US$1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
Keysight, NTT, and NTT Innovative Devices Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G
06/17/2025 | Keysight TechnologiesKeysight Technologies, Inc. in collaboration with NTT Corporation and NTT Innovative Devices Corporation (NTT Innovative Devices), today announced a groundbreaking world record in data rate achieved using sub-THz frequencies.