Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
HyRel to Showcase Robotic Hot Solder Component Tinning Innovation at SMTA Silicon Valley Expo & Tech Forum
November 15, 2023 | HyRelEstimated reading time: 1 minute
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is pleased to announce plans exhibit its groundbreaking Robotic Hot Solder Component Tinning technology at the SMTA Silicon Valley Expo & Tech Forum on Thursday, Dec. 7, 2023, hosted at Flextronics in Milpitas, CA.
HyRel Technologies is at the forefront of the Robotic Hot Solder Component Tinning process. Their groundbreaking work has not only secured approval from TMTI but has also positioned them as leaders in the industry, recognized by prestigious awards for their innovative technology.
HyRel has achieved a state-of-the-art “touchless” technique for tin dendrite removal, solder alloy replacement, and the restoration of solderability. This breakthrough process sets new standards for high component reliability, meeting the stringent demands of modern manufacturing.
Its mastery of robotic solutions and proven processes has enabled the company to achieve levels of precision and repeatable quality that stand unparalleled in the industry. The Robotic Hot Solder Component Tinning process, with proven applications in ROHS compliance, tin dendrite removal, component reuse, and solderability restoration, showcases the company's commitment to excellence.
The company is proud to be compliant with critical industry standards, including GEIA-STD-0006, ANSI – J-STD-002, Mil-STD202, and Mil – STD-883. This reflects the company's dedication to producing technology that meets the highest performance and reliability criteria, ensuring that its innovations align with industry benchmarks.
Attendees can explore their booth at the SMTA Silicon Valley Expo & Tech Forum. Experience firsthand the advancements in robotic soldering technology and learn about the transformative applications of the Robotic Hot Solder Component Tinning process.
Share on:
Suggested Items
Count On Tools Recognizes Donna Orr’s Ongoing Leadership and Impact Across 27+ Years
06/26/2025 | Count On ToolsCount On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, is proud to recognize Donna Orr, Executive Manager, for her continued dedication and leadership as she marks more than 27 years with the company.
A Record Year for the 75th Annual IEEE Electronic Components and Technology Conference (ECTC)
06/26/2025 | ECTCThe 75th annual 2025 IEEE Electronic Components and Technology Conference (ECTC), held at the Gaylord Texan Resort & Convention Center here May 27-30, had record attendance, a record number of paper submissions/presentations, record international and student participation, and a record number of exhibitors in a sold-out exhibition hall:
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.