HyRel to Showcase Robotic Hot Solder Component Tinning Innovation at SMTA Silicon Valley Expo & Tech Forum

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HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is pleased to announce plans exhibit its groundbreaking Robotic Hot Solder Component Tinning technology at the SMTA Silicon Valley Expo & Tech Forum on Thursday, Dec. 7, 2023, hosted at Flextronics in Milpitas, CA.

HyRel Technologies is at the forefront of the Robotic Hot Solder Component Tinning process. Their groundbreaking work has not only secured approval from TMTI but has also positioned them as leaders in the industry, recognized by prestigious awards for their innovative technology.

HyRel has achieved a state-of-the-art “touchless” technique for tin dendrite removal, solder alloy replacement, and the restoration of solderability. This breakthrough process sets new standards for high component reliability, meeting the stringent demands of modern manufacturing.

Its mastery of robotic solutions and proven processes has enabled the company to achieve levels of precision and repeatable quality that stand unparalleled in the industry. The Robotic Hot Solder Component Tinning process, with proven applications in ROHS compliance, tin dendrite removal, component reuse, and solderability restoration, showcases the company's commitment to excellence.

The company is proud to be compliant with critical industry standards, including GEIA-STD-0006, ANSI – J-STD-002, Mil-STD202, and Mil – STD-883. This reflects the company's dedication to producing technology that meets the highest performance and reliability criteria, ensuring that its innovations align with industry benchmarks.

Attendees can explore their booth at the SMTA Silicon Valley Expo & Tech Forum. Experience firsthand the advancements in robotic soldering technology and learn about the transformative applications of the Robotic Hot Solder Component Tinning process.