ECD Introduces 20-Channel M.O.L.E. EV20 Touchscreen Thermal Profiler
November 15, 2023 | ECDEstimated reading time: 2 minutes
ECD has developed a new 20-channel M.O.L.E. touchscreen thermal profiler for high-value, high-reliability electronic assemblies that require multiple thermal measurements. The M.O.L.E. EV20 is the second product in ECD’s EV-series thermal profilers, built on the market’s only profiling platform with full-color touchscreen control. M.O.L.E. EV20 replaces the company’s MEGAM.O.L.E. 20 and delivers significant ease-of-use and technological enhancements.
Foremost among the M.O.L.E. EV20’s productivity benefits is the process control immediacy it offers operators. Thermal profiles can be seen in real time, allowing corrective actions if required. By contrast, other thermal profilers require a PC data download, which adds time and complexity to the process. Calculation templates, configuration, profile selection and modification, and pass/fail analysis are all managed through the intuitive, handheld touchscreen M.O.L.E. EV20. The ability to interact with and control the profiler on the shop floor helps reduce required operator training, limits errors, and raises efficiency.
While the touchscreen management capability is the most significant element of the redesign, the new M.O.L.E. EV20 has also integrated user-friendly and economical features compared to its predecessor, as ECD Electronics Division Manager Mark Waterman explains.
“We wanted to use the new platform as an opportunity also to add simplicity and cost-effectiveness to high channel count capability,” Waterman says. “For example, M.O.L.E. EV20 uses standard mini-connectors as opposed to proprietary thermocouple inputs, has universal USB C charging, Bluetooth wireless connectivity, an off-the-shelf battery, two-button on/off and record control, and built-in maintenance reminders. Moreover, our unique design has maintained the same thermal barrier thickness and width as MEGAM.O.L.E. 20.”
The dimensions of M.O.L.E. EV20 are notable because the thin, narrow profile allows the data logger to comply with all reflow oven clearance restrictions while allowing 20 measurements to be collected in a single run. This is not the case with all multi-input profiling options. With other profilers, the device design is very thick to accommodate high channel counts, or multiple runs must be conducted to collect the numerous readings required for densely populated, high-value PCB assemblies.
“Our engineering team thoughtfully designed M.O.L.E. EV20 with the operator’s perspective in mind,” Waterman explains. “We’re confident our newest touchscreen EV profiler ticks all the boxes.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Molex Accelerates Supply Chain Transformation with Celonis AI
04/17/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.
Molex Accelerates Supply Chain Transformation with Celonis AI
04/16/2026 | BUSINESS WIRECelonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.
Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption
04/15/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.
Molex Boosts AI Clusters with Optical Interconnects
03/19/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers.
New Product Launches Spur Demand Recovery as Global Smartphone Panel Shipments Rise 8.1% in 3Q25
11/11/2025 | TrendForceTrendForce’s latest investigations reveal that global shipments of smartphone panels reached 586 million units in the third quarter of 2025, up 8.1% QoQ and 5.3% YoY.