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Advanced Electronics Packaging Digest

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Molex Completes Acquisition of Teramount Ltd.

05/07/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

Molex Accelerates Supply Chain Transformation with Celonis AI

04/17/2026 | BUSINESS WIRE
Celonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.

Molex Accelerates Supply Chain Transformation with Celonis AI

04/16/2026 | BUSINESS WIRE
Celonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.

Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption

04/15/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.

Molex Boosts AI Clusters with Optical Interconnects

03/19/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has unveiled a robust product roadmap for delivering the full technology stack needed to address the massive scaling requirements of hyperscale data centers.
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