-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
ECD Introduces 20-Channel M.O.L.E. EV20 Touchscreen Thermal Profiler
November 15, 2023 | ECDEstimated reading time: 2 minutes
ECD has developed a new 20-channel M.O.L.E. touchscreen thermal profiler for high-value, high-reliability electronic assemblies that require multiple thermal measurements. The M.O.L.E. EV20 is the second product in ECD’s EV-series thermal profilers, built on the market’s only profiling platform with full-color touchscreen control. M.O.L.E. EV20 replaces the company’s MEGAM.O.L.E. 20 and delivers significant ease-of-use and technological enhancements.
Foremost among the M.O.L.E. EV20’s productivity benefits is the process control immediacy it offers operators. Thermal profiles can be seen in real time, allowing corrective actions if required. By contrast, other thermal profilers require a PC data download, which adds time and complexity to the process. Calculation templates, configuration, profile selection and modification, and pass/fail analysis are all managed through the intuitive, handheld touchscreen M.O.L.E. EV20. The ability to interact with and control the profiler on the shop floor helps reduce required operator training, limits errors, and raises efficiency.
While the touchscreen management capability is the most significant element of the redesign, the new M.O.L.E. EV20 has also integrated user-friendly and economical features compared to its predecessor, as ECD Electronics Division Manager Mark Waterman explains.
“We wanted to use the new platform as an opportunity also to add simplicity and cost-effectiveness to high channel count capability,” Waterman says. “For example, M.O.L.E. EV20 uses standard mini-connectors as opposed to proprietary thermocouple inputs, has universal USB C charging, Bluetooth wireless connectivity, an off-the-shelf battery, two-button on/off and record control, and built-in maintenance reminders. Moreover, our unique design has maintained the same thermal barrier thickness and width as MEGAM.O.L.E. 20.”
The dimensions of M.O.L.E. EV20 are notable because the thin, narrow profile allows the data logger to comply with all reflow oven clearance restrictions while allowing 20 measurements to be collected in a single run. This is not the case with all multi-input profiling options. With other profilers, the device design is very thick to accommodate high channel counts, or multiple runs must be conducted to collect the numerous readings required for densely populated, high-value PCB assemblies.
“Our engineering team thoughtfully designed M.O.L.E. EV20 with the operator’s perspective in mind,” Waterman explains. “We’re confident our newest touchscreen EV profiler ticks all the boxes.”
Suggested Items
AirBorn Announces Agreement to be Acquired by Molex
11/18/2024 | PRNewswireAirBorn, a global manufacturer of high reliability electronics and components, announced it has entered into an agreement to be acquired by Molex, a leading global connectivity and electronics solutions provider.
Molex Drives Intelligent Supply Chain Collaboration with SAP Solutions
10/24/2024 | PRNewswireMolex, a global electronics leader and connectivity innovator, announced a highly successful collaboration with SAP to unite a global community of suppliers and buyers as part of Molex's multi-year, intelligent digital supply chain transformation strategy.
AMOLED Panels Become Mainstream Display for Smartphones, with Shipments Set to Grow by Nearly 25% in 2024
09/06/2024 | TrendForceTrendForce’s latest projections show global shipments of AMOLED smartphone panels are anticipated to surpass 840 million units in 2024, reflecting a remarkable growth of almost 25% from 2023.
Foldable Phones Drive Penetration of Mid-to-High-End Backplane Technology to 60% by 2025
08/26/2024 | TrendForceTrendForce’s latest investigations into backplane technology for displays reveal that OLED has become the mainstream display solution for smartphones, pushing the penetration rate of mid-to-high-end backplane technologies such as LTPS and LTPO in the smartphone market to nearly 57% in 2024.
DigiKey Debuts City Digital Season 4 Video Series Focused on Artificial Intelligence
06/28/2024 | Digi-KeyDigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced the release of Season 4 of the City Digital video series, “AI in the Smart World,” sponsored by Molex and STMicroelectronics.