Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025

09/04/2024 | IPC
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis. The deadline for proposals is on November 8, 2024.

Arrow Electronics, Citrix Sign Strategic Citrix Service Provider Distribution Agreement for North America and EMEA

08/30/2024 | BUSINESS WIRE
Global technology provider Arrow Electronics and Citrix, a business unit of Cloud Software Group, Inc., today announced a strategic distribution agreement.

Dr. Jennie Hwang to Deliver Course on AI Opportunities, Challenges, Possibilities at SMTAI

08/28/2024 | Dr. Jennie Hwang
Dr. Jennie Hwang, Chair of AI Committee of National Academies/DoD AI study, Chair of Review Panel of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course. 

Adam Klett, KYZEN Director of Science, Re-elected to SMTA Board

08/21/2024 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries is proud to announce the re-election of Adam Klett, KYZEN Director of Science, to the SMTA Global Board of Directors. During his first term on the SMTA Global Board of Directors from 2021-2024, Klett lead the Students and Young Professionals Committee in addition to serving on the Strategic Development Committee. He is currently chair of the Nominating Committee for 2024.

Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea

08/21/2024 | SEMI
With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in