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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

06/04/2026 | Stanton Rak, SF Rak Company
EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

Taiwan's PCB Industry Balances AI Opportunities with Risk Management

06/01/2026 | TPCA
To address the multiple risks arising from the intertwining of geopolitics, sustainable transformation, and the AI wave, the Taiwan Printed Circuit Association (TPCA) established the Sustainability and Risk Governance Committee.

Apprenticeship Summit Highlights Electronics Workforce ‘Puzzle’

05/27/2026 | Victoria Hawkins, Global Electronics Association
Last week, I had the opportunity to attend the 2026 Apprenticeships for America Summit in Washington, D.C., and it was both energizing and informative to be surrounded by so many leaders working to strengthen and scale apprenticeships across the country. The summit brought together employers, intermediaries, workforce leaders, educators, policy experts, and apprenticeship advocates to discuss some of the most important topics in our field

BAE Systems Announces Facility Upgrades to Enhance U.S. Military Readiness

05/25/2026 | BAE Systems
BAE Systems announced a $135 million investment for facility enhancements in Austin, Texas and Hudson, New Hampshire, further strengthening the U.S. defense industrial base.

Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity

05/08/2026 | Global Electronics Association
Chris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
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