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Advanced Electronics Packaging Digest

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Foxconn, Mitsubishi Electric Finalize Automotive Equipment Alliance

10/16/2026 | Foxconn
Through the alliance, the companies aim to develop next-generation mobility and thereby strengthen the sustainable growth of the Japanese automotive industry.

AIM Solder Signs New Distributor X5 Company in Brazil

10/16/2026 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the signing of X5 Company as a new distributor in Brazil.

Wolfspeed Secures Conditional $1.5B U.S. Defense Loan Commitment

10/14/2026 | Wolfspeed
Wolfspeed, Inc. announced it has received a conditional loan commitment letter from the U.S. Department of War (DoW), through its Office of Strategic Capital (OSC), for up to $1.5 billion of long-term financing to support the domestic development and production of silicon carbide (SiC) materials and wide bandgap power devices, with an additional focus on U.S. national security applications.

Merlin Flex Achieves ISO27001 Accreditation

10/02/2026 | Merlin Flex Ltd
Merlin Flex Ltd has achieved ISO 27001 accreditation, further strengthening its commitment to information security and the protection of customer and business-critical data.

MIT’s Yossi Sheffi to Headline Global Electronics Association APEX EXPO 2027

09/30/2026 |
The Global Electronics Association announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote address at APEX EXPO 2027 on Tuesday, April 6, focused on the forces reshaping the global electronics industry.
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