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Calumet Electronics, Schmid Group Collaborate to Establish First-Ever US Advanced Substrate Facility

02/13/2024 | SCHMID Group
Calumet Electronics, a leading American printed circuit board manufacturer is pioneering the domestic production of advanced packaging substrates.

A Progress Report: Investing in U.S. PCB Fabricators

12/19/2023 | Nolan Johnson, I-Connect007
In the geopolitical arena, the supply chain lessons learned during the pandemic continue to be addressed with long-range plans as well as short-term stopgaps. In this conversation, David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), provides a progress update on the U.S. CHIPS Act, and some of the fan-out dynamics already playing out. As David explains, there is new investment in PCB fabrication that has nothing to do with the CHIPS Act.

DOD Awards $39.9 Million to Strengthen U.S. Supply Chains for PCBs

11/16/2023 | U.S. DoD
The Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/03/2023 | Nolan Johnson, I-Connect007
When I use our analytics to see what’s of most interest to our readers, what comes to the top of list are topics such as sustainability, materials, reshoring, upskilling, and high reliability. It makes sense, doesn’t it? In today’s business climate, we must be ever aware of the impact we’re having on the environment while maintaining a high-quality product that supports our national economic and security interests.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/27/2023 | Andy Shaughnessy, Design007 Magazine
I don’t know everything, but I know one thing: This job is never boring. Here’s just a sample of what we’ve published online in the last week: an article on zero liquid discharge technology, an interview with a flex fabricator about avoiding DFM issues, a feature on the use of AI in smart assembly processes, a news item about investment in advanced substrate development in the U.S., and a story about one woman’s journey in electronics, starting when she learned to solder at 11 years old.
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