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Jaltek Forge Partnership to Target New ‘Agritech’ Business

07/26/2024 | Jaltek
Jaltek is thrilled to announce it has signed a new partnership that will give ‘agritech’ innovators seeking contract manufacturing and electronics solutions a single point of contact.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/26/2024 | Nolan Johnson, I-Connect007
This week, I’ve been attending Thailand Electronic Circuits Asia 2024. This is the inaugural event, hosted by Thailand Printed Circuit Association (THPCA) in collaboration with the Hong Kong Printed Circuit Association (HKPCA). Thailand has supported a PCB industry for some time—mostly automotive applications—but the China Plus One dynamic has definitely taken root here.

Amphenol Reports Record Q2 2024 Results and Announces Dividend Increase

07/26/2024 | Amphenol Corporation
The Company continues to deploy its financial strength in a variety of ways to increase shareholder value. During the quarter, the Company purchased 3.1 million shares of its common stock for $190 million and paid dividends of $132 million, resulting in total capital returned to shareholders of more than $320 million.

iNEMI Packaging Tech Topic Webinar: Equipment Capabilities and Challenges to Support Advanced Packaging Trends

07/26/2024 | iNEMI
Modern day computing needs, notably AI/machine learning and high-performance computing, along with their subsequent memory and I/O requirements, are fueling an increased demand for semiconductor devices with higher performance, lower power consumption and latency as well as reduced footprint.

Flex Reports Q1 Fiscal 2025 Results, Announces Chief Financial Officer Transition

07/25/2024 | Flex
"We delivered another solid quarter, including year-over-year margin expansion and EPS growth," said Revathi Advaithi, CEO of Flex. "Our results show we continue to navigate through the dynamic cycle and drive value to our stakeholders."
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