Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps

06/01/2026 | Don Ball -- Column: The Chemical Connection
This month, I’m taking another look at additive manufacturing. What does mSAP, SAP, and additive metallizing (plating) look like in today’s advanced PCB fabrication? I must confess I don’t have a lot of insight, as my whole career has been devoted to removing copper from panel surfaces in even and controlled ways, and not to putting copper back on the panel. However, at some point in the additive process, especially in additive plating, copper must be removed from between the conducting surfaces to complete the circuits. Here, I can address some of the consequences of additive metallizing on subsequent etching steps.

Single Pair Ethernet (SPE): A Valuable Option for Modern Designs

04/20/2026 | Marcy LaRont, I-Connect007
When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.

Below the Surface: Looking Ahead to Where Integration Actually Happens

04/20/2026 | Chandra Gupta -- Column: Below the Surface
Progress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.

Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense

04/14/2026 | Jesse Vaughan -- Column: Beyond the Board
As mil/aero electronics push toward higher density, tighter tolerances, and more complex constructions, another trend has unfolded in parallel. It receives far less attention but carries equal consequence: A significant reduction in the number of fabricators that can support complex PCB manufacturing.

The Pivotal Role of AI in Modern Electronics Manufacturing with Koh Young

04/03/2026 | Real Time with... APEX EXPO
Joel Scutchfield, of Koh Young America shares how accurate, measurement-based data fuels AI engines for enhanced inspection, auto-programming, and defect classification. Joel emphasizes how self-correction capabilities and data sharing across production lines, driving towards a future of automated, defect-free manufacturing.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in