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Advanced Electronics Packaging Digest

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Foxconn Research Develops 34.1 Tbps Silicon Photonics Technology

07/30/2026 | Foxconn
Foxconn Research Institute, in collaboration with National Yang Ming Chiao Tung University, has developed a 34.132 Tbps ultra-high-capacity silicon photonics transmission technology designed to address growing data bandwidth demands driven by artificial intelligence (AI).

SPARK Microsystems Expands European Distribution Network with Alcom Electronics

07/30/2026 | BUSINESS WIRE
SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, announced the expansion of its distribution channel in Northwest Europe, welcoming Alcom Electronics to SPARK’s partner network.

NVIDIA, Broadcom Ramp CPO Switch Production

07/27/2026 | TrendForce
TrendForce's latest research on the optical communications industry reveals that NVIDIA has begun shipping its next-generation Spectrum-X CPO switch to select partners.

Mixx Technologies Acquires Sophic Silicon Technologies and Announces Manufacturing Collaboration with Kaynes Semicon

07/23/2026 | PR Newswire
Mixx Technologies, Inc., a US based venture-backed deep-tech company building the interconnect layer for hyperscale AI infrastructure, today announced two simultaneous strategic moves that together mark a defining moment in India's semiconductor journey.

AMD and Anthropic Announce Strategic Partnership to Deploy Up to 2 Gigawatts of AMD Instinct MI450 Series GPUs

07/23/2026 | AMD
AMD and Anthropic today announced a strategic partnership to deploy up to 2 gigawatts of AMD Instinct MI450 Series GPUs in AMD Helios rack-scale solutions, with deployment of the first gigawatt beginning in the first half of 2027.
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