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Advanced Electronics Packaging Digest

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Suggested Items

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.

Zhen Ding Technology Reports August 2026 Monthly Revenue

09/08/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported August 2026 revenue of NT$20,666 million, up 41.05% YoY and 17.42% MoM, again setting a record high for the same period in the company’s history.

High-Resolution Phase Modulation for Holography, Quantum Computing and Adaptive Optics

09/08/2026 | Fraunhofer-Gesellschaft
The Fraunhofer Institute for Photonic Microsystems IPMS is one of the world’s leading research institutions in the field of spatial light modulators.

Crealights, GlobalFoundries Deepen Global Strategic Partnership

09/08/2026 | ACN Newswire
Crealights officially announced a landmark partnership, establishing a long-term, in-depth strategic collaboration with GlobalFoundries, a leading global semiconductor manufacturer.

Teledyne Qioptiq Receives $21M+ Germany Order for PHOENIX-XR Thermal Sights

09/04/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated announced that Teledyne Qioptiq has received the first option from the German Bundeswehr for PHOENIX-XR cooled weapons sights valued at more than $21 million.
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