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The Chemical Connection: An Exhibitor’s View of IPC APEX EXPO

02/28/2024 | Don Ball -- Column: The Chemical Connection
When I learned that this issue would be dedicated to optimizing the bare board fabricator’s experience at the IPC APEX EXPO 2024, I thought it would be an easy column to write. With more than 40 of these shows under my belt, I didn’t think it would be too difficult to come up with a list of dos and don’ts to make your visit to an exhibitor’s booth worthwhile. So, what can you do to make your visit even more useful?

Yamaha Introduces Latest Upgrades to its 3D AOI Systems

02/20/2024 | Yamaha Robotics SMT Section
Yamaha Robotics SMT Section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.

SMTA Capital Chapter Expo and Tech Forum Showcases Innovation in Electronics Manufacturing

02/19/2024 | SMTA
The SMTA Capital Chapter is excited to announce the upcoming SMTA Capital Chapter Expo and Tech Forum, scheduled for March 7th, 2024, at Sweeny Barn in Manassas, Virginia.

The Chemical Connection: Getting to Know Your Vendor

02/16/2024 | Don Ball -- Column: The Chemical Connection
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.

DOCOMO to Collaborate with AT&T, Verizon and Jio for Open RAN Verifications

02/15/2024 | JCN Newswire
NTT DOCOMO, INC. announced today that it will participate in Open RAN verifications in the United States as the ACCoRD (Acceleration of Compatibility and Commercialization for Open RAN Deployments) project in a consortium jointly founded with AT&T Inc. (AT&T), Verizon Communications Inc. (Verizon), and Reliance Jio Infocomm Ltd. (Jio).
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