Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
It’s Only Common Sense: The Phone Is Still Your Competitive Advantage
Ventec Strengthens VT-901 / VT-90H Polyimide Supply Chain
December 5, 2023 | Ventec International GroupEstimated reading time: 2 minutes
Following last year's investment in new prepreg treating capacity at its Taiwan facility, Ventec International Group continues to focus on diversifying its manufacturing footprint and capability for its VT-901 / VT-90H high performance polyimide laminates and prepregs.
By extending its Taiwan based manufacturing capabilities for VT-901 / VT-90H, Ventec has further enhanced global supply chain resiliency for its global customer base. The new prepreg treater has enabled Ventec to ramp up capability and capacity at its Taiwan facility. As a first step, Ventec is now able to supply the full range of its VT-901 and VT-90H polyimide laminates and prepregs at high volumes, in addition to adding production capability to supply No Flow/Low Flow prepregs for rigid flex applications from this facility. Other high performance material transfers are planned for 2024.
Ventec’s wholly owned supply chain is unique among PCB materials suppliers and ensures unrivalled control over not just production quality, but also lead-time and delivery performance to its global high-tech customer base. The strategic actions that decentralize and duplicate manufacturing capability for Ventec’s full range of high-reliability and high-performance products are designed to mitigate supply chain risks for PCB manufacturers, OEMs, and EMSs across all regions by adding geographical diversity to the company’s operations. With all parts of the manufacturing and distribution supply chain covered by AS9100 accreditation, customers can confidently partner with Ventec with full trust in the company’s ability to meet and exceed the increasingly stringent industry requirements for aerospace, defense, and military applications globally.
“The increased capacity and capability at our Taiwan facility is the latest step in our global strategy to significantly increase our manufacturing footprint outside of China. The increased capacity allows Ventec to widen the product range produced in Taiwan starting with our full range of high-performance polyimide materials,” said Jason Chung, CEO of Ventec.
Mark Goodwin, COO EMEA & America added: “Decentralized manufacturing enhances Ventec’s supply chain resilience, which is crucial in the current geopolitical context as we strive to serve our customers’ needs for high performance materials globally.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Green Circuits Heads to Peterson SFB to Support Next-Gen Space and Defense Electronics
05/05/2026 | Green CircuitsThe event, hosted at Peterson Space Force Base, brings together key personnel and mission partners supporting critical U.S. defense and space operations.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.