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December 8, 2023 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on the application of new soldering thermal interface materials (TIMs) in advanced packaging at SiP China Conference 2023 on December 13 in Shanghai.
As high-performance computing, cloud computing, artificial intelligence, and autonomous driving applications continue to develop, increased power is required for CPUs and GPUs. In turn, increased computing power generates exponentially more heat. The use of indium or indium-based alloy as soldering TIMs is considered to be one of the best solutions to this challenge. As a result, Outsourced Semiconductor Assembly and Test (OSAT) companies in China and other countries have intensified research and development in this area.
“Indium Corporation has 90 years of experience in the production of pure indium and indium-based alloys and more than 20 years in applying solder TIMs,” said Hu. “I look forward to sharing this collective expertise with my colleagues as we explore the innovation and application of solder TIMs with respect to alloys, fluxes, and manufacturing processes.”
As Senior Area Technical Manager for East China, Hu manages the technical support team in East China, and collaborates with global technical support teams to provide Indium Corporation customers with product and application solutions. He has more than 15 years of experience in semiconductor packaging and possesses expertise in advanced assembly technology development, process improvement, and assembly materials applications. Hu earned a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
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