Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Drip by Drip: Semiconductor Water Management Innovations

03/05/2025 | IDTechEx
Not only does semiconductor manufacturing require large volumes of energy, chemicals, and silicon wafers, it also requires vast volumes of water. IDTechEx’s latest report, “Sustainable Electronics and Semiconductor Manufacturing 2025-2035: Players, Markets, Forecasts”, forecasts water usage across semiconductor manufacturing to double by 2035, as demand for integrated circuits continues to rise. 

Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces

02/28/2025 | PRNewswire
Neural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.

The Chemical Connection: Earthquakes, Astronauts, and Aquatics—A Lighter Look at the Past

02/25/2025 | Don Ball -- Column: The Chemical Connection
IPC will host its 25th IPC APEX EXPO with the theme “Reimage the Possibilities,” in Anaheim, California, next month. It will also mark the 68th anniversary of IPC’s founding. This year’s event brings up many memories of IPC APEX EXPO’s past and former National Electronics Packaging Conferences (NEPCONs). In this column, I would like to share some of the lighter moments from my almost 50 years of exposition experiences—especially those in Anaheim.

EIPC 2025 Winter Conference: Business Outlook and New EMS Opportunities

02/18/2025 | Pete Starkey, I-Connect007
“Navigating and Optimizing Complex Processes: How to Overcome Today’s and Tomorrow’s Challenges in PCB Processing” was the theme of the 2025 EIPC Winter Conference, held Feb. 4–5, in historic Luxembourg City, the capital of Luxembourg, a small country in the heart of western Europe with borders to Belgium, France, and Germany. EIPC president Alun Morgan welcomed delegates from more than 70 companies in Europe and beyond, and thanked the sponsors of the event. Morgan can always be relied upon for a topical opening presentation. This time, he addressed “Internet of Things: Vulnerabilities and How to Address Them.”

AI Server Growth in 2025 Faces Uncertainties, DeepSeek Effect to Boost AI Inference Share

02/13/2025 | TrendForce
TrendForce’s latest investigations reveal that global AI server shipments grew by 46% in 2024, driven by strong demand from CSPs and OEMs. However, multiple factors, including US chip restrictions, the DeepSeek effect, and supply chain readiness for GB200/GB300 racks, could impact AI server shipments in 2025. TrendForce has outlined the following three scenarios based on these uncertainties.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in