Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

06/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications:

Pembroke Instruments Launches Thermal Imaging Microscope for Semiconductor Failure Analysis

06/09/2026 | Pembroke Instruments, LLC
Pembroke Instruments, LLC announced the availability of its integrated Thermal Imaging Microscope platform designed for electronics testing, semiconductor failure analysis, PCB inspection, solar cell evaluation, battery analysis, and advanced materials research.

Insulectro Signs Covestro as Supplier of Advanced Substrates

06/09/2026 | Insulectro
Insulectro, the largest distributor of materials used in the manufacturing of printed circuit boards and printed electronics, welcomes Covestro as its newest supplier.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to...UV Curable Conformal Coatings, Chapter 1

06/09/2026 | I-Connect007
Chapter 1: Options for Protecting Electronic Assemblies and a Deep Dive into UV Conformal Coatings. Electronics, depending on fit and function, have different protective options including conformal coatings, potting materials, encapsulants, protective enclosures, sealing and gaskets.

Rewriting Metallization, One Ink at a Time

06/09/2026 | Marcy LaRont, I-Connect007 Magazine
Additive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, interconnects, and beyond.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in