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Creation Technologies Launches LEAP Program: Delivering Industry Leading New Product Realization Capabilities
December 11, 2023 |Estimated reading time: 2 minutes
As an established contract design and manufacturing partner for leading medical & life science, tech industrial, and aerospace & defense OEMs, Creation has developed the LEAP program to enhance New Product Realization.
LEAP, Launch with Excellence to Advanced Production, is Creation’s proprietary Stage Gate process that covers all aspects of the product lifecycle from engineering prototypes for new designs through to ramp to full production volumes.
The Stage Gate model is designed to improve the quality of product launch activities as well as burn down risk, refine costs and reduce variation at each stage gate. The process puts a heavy focus on planning, DFx and requirements gathering and helps teams prepare the right information, with the right level of detail, at the right time to deliver value to the customer.
“Creation Technologies is committed to exceeding our customer expectations throughout the Product Development & Lifecycle Process,” said Diana Ferrari, SVP of Customer Engineered Solutions. “We developed this program to give our partners the opportunity to lean on Creation with early engagement to provide excellent guidance and risk avoidance advice.”
Creation’s stage gate process was initially developed through a series of kaizen events with NPI thought leaders from each of our sites and all functions represented. It also included a thoughtful Voice of the Customer exercise. Many of our customers provided their insights into what would make Creation their trusted partner of choice for NPI.
The LEAP Stage Gate process was piloted and refined in 2021. Each of our sites were individually trained, including Program Management, Engineering, Quality and Supply Chain teams – a total of over 500 trainees!
Over 200 NPIs have been launched through LEAP and feedback from our customers has been clear – the results show products launching with a faster time to ramp and better quality. Here’s what our customers are saying:
”Creation identified what was needed to onboard us as a customer and followed up when we were holding things up. Creation was proactive in identifying risks and offering mitigation options….it allowed us to take on appropriate risks with our eyes wide open.”
“The team was heavily involved in cross-functional coordination in moving the business from one location to another. The communication was great.”
Across the enterprise, we have over 30 LEAP Bronze Certified Leaders ready to help launch your next new product. In 2024, all NPI, including new designs and existing design transfers, are running through the LEAP stage gate process.
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Scanfil Is Preparing for a Changing Trading Environment
03/19/2025 | ScanfilAs the potential for new tariffs continues to evolve, Scanfil is committed to ensuring that its global manufacturing network is prepared to offer support should the need arise for a shift of manufacturing locations, whether domestically or internationally.
SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment
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Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
iNEMI HDI Socket Warpage Prediction and Characterization Webinar
11/15/2024 | iNEMIHigh-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.
GPV Exhibits at Electronica 2024
09/19/2024 | GPVFrom 12 to 15 November 2024, GPV participates at Electronica in Munich, Germany. Find us in Hall A1, stand no. 115.