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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Register Now for the IPC Design Competition 2024
December 19, 2023 | IPC StaffEstimated reading time: 1 minute
Every year, thousands of printed board design engineers spend countless hours completing and perfecting their designs. IPC is inviting these designers to put their skills to the test and compete to become the IPC Design Champion of 2024.
“I’m really excited about the IPC Design Competition,” said Patrick Crawford, Manager of Design Standards. “There’s still time to register, so don’t miss out.”
As in previous years, the IPC Design Competition is composed of two parts: a Virtual Heat and a Finals Heat. Each heat features a board design created especially for this competition by IPC instructor Kris Moyer.
The Virtual Heat consists of a full board buildup, starting with a component BOM, schematic, and use-case brief. Competitors will be responsible for completing the board and exporting a documentation package via Gerber or IPC-2581. Competitors can use their own preferred EDA tools.
This year, IPC has made this design easier to complete in the time allotted. The preliminary designs should take no longer than 10-12 hours for the average designer to complete. Competitors have 25 days to complete their Virtual Heat design and are judged on their implementation of design rules and layout per IPC standards as well as general implementation of DFX principles.
The Finalist Heat will take place at IPC APEX EXPO in Anaheim, California on April 9, 2024. Three finalists will be invited to IPC APEX EXPO for an in-person layout showdown. Competitors will be provided complimentary short-term licenses of Altium Designer to use for the Finals Heat.
Can you route the best board and take home the prize? If you think you have what it takes, register now by clicking here.
Registration closes January 12, 2024, so don’t wait!
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Simon Khesin - Schmoll MaschinenSuggested Items
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.