-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
New Podcast Series Launches: Optimize the Interconnect
July 10, 2025 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is excited to announce the debut of Optimize the InterconnectSM—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
In the premiere two-part episode, “What is OTI?,” Ryder breaks down the foundational ideas behind the Optimize the Interconnect (OTI) approach. This unified strategy brings together laser processing, surface treatment, and plating chemistry to improve via reliability, performance, and production efficiency.
This series complements the just-released companion guide, which offers engineering teams a technical deep dive into unified via formation and real-world case studies demonstrating the benefits of OTI.
- Listen to the first episode here.
- Read the companion guide here.
Stay tuned! This is the start of an essential conversation around more innovative, faster, and more integrated interconnect solutions.
Suggested Items
Airbus-built MetOp-SG Weather and Climate Satellite Shipped to Kourou
06/06/2025 | AirbusReady for launch - the first of the Airbus-built MetOp-SG weather and climate monitoring satellites left Toulouse cleanrooms a few days ago and is now en-route for Kourou, French Guiana onboard the “Canopée” transport ship.
Bourns Releases Two Compact NTC Thermistor Series Offering High-Precision Temperature Sensing and Compensation
06/05/2025 | BournsBourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, announced its BTN02G and BTN04G Series SMD Negative Temperature Coefficient (NTC) Thermistors.
Bourns Introduces Line Filter Series with Ferrite Toroid Core that Delivers High Impedance Over a Broad Frequency Range
05/30/2025 | BournsBourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, introduced a new filter series designed with a ferrite toroid core. Bourns specifically engineered its SRF1360 line filters to deliver high impedance over a broad frequency range.
L3Harris to Support Canada’s National Security with Imaging Technology
05/27/2025 | L3Harris TechnologiesL3Harris Technologies has received a contract from the Canadian Commercial Corporation to provide 16 WESCAM MX™-20 surveillance and targeting systems to support the country’s P-8A aircraft.
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
05/20/2025 | Deca TechnologiesDeca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.