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What’s Happening With Financing Solutions?
December 20, 2023 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Amy Pine and Brian Carey are principles of Innovative Capital Resources, a financing resource for electronics manufacturing with a 20-plus year history. They briefed the I-Connect007 Editorial Team on what they’re seeing in the financing side of the industry, how it compares to the past, and a bit of what they see over the horizon in 2024. Hint: There’s some good news for investors.
Nolan Johnson: Amy and Brian, please introduce us to Innovative Capital Resources. What’s your mission and your specialty?
Amy Pine: We specialize in providing financing and leasing to high tech manufacturing companies specific to the electronics market, meaning assembly and board fab. Brian and I worked together prior to Innovative Capital at Copelco/CitiCapital. He financed his first pick-and-place machine in the 1980s. We work with multiple funding sources, educating them on the electronics market and the type of equipment that contract manufacturers or OEMs use to assemble and inspect boards or to manufacture and fab boards. Over time, we have built relationships with vendors, customers, and our lenders.
Brian Carey: When we started in 2002, you may remember, it was in the middle of the “tech wreck.” Amy and I were going to trade shows, saying that we specialized in the electronics market. It really sounded like a recipe for disaster because everything was going overseas, but it gave us a jump.
We really care about this industry.
Continue reading this interview in the December 2023 issue of SMT007 Magazine.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
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Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
ASC Sunstone Circuits to Exhibit at AEMS 2025
09/09/2025 | American Standard CircuitsASC Sunstone Circuits will be exhibiting at AEMS 2025 (Anaheim Electronics and Manufacturing Show) to be held at the Anaheim Convention Center on September 24 and 25, 2025.
What EMS Firms Want From Their Software—and What They Get
09/03/2025 | Thiago Guimaraes, Global Electronics AssociationLast November, the Global Electronics Association [as IPC] surveyed EMS and OEM companies to better understand the software tools driving their operations and uncover trends in adoption, satisfaction, and challenges. The survey assessed software tools across critical functions, including ERP, MES, PLM, QMS, LMS, quoting systems, and CRM. Participants shared insights on tool adoption, satisfaction, and selection priorities.
Industry Icon Walt Custer Passes Away
09/02/2025 | I-Connect007 Editorial TeamWe regret to announce that Walt Custer passed away on Aug. 30, 2025. Walt’s son, Jonathan, shared the following: I am in complete shock that my dad, Walt Custer, is gone, and I am comforted that he died peacefully at 81 years old. Walt built CCG from the ground up 26 years ago, guided by his passion, hard work, and commitment to the printed circuit board community. His dedication not only established our company, but he frequently shared his experience as a chemist and industry executive veteran to provide market insights as an analyst, an avid speaker, a magazine columnist, a board and committee member and a data contributor for the electronics manufacturing community.