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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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TopLine Ships JEDEC Matrix IC Trays and Waffle Packs from Stock

07/30/2026 | TopLine
TopLine ships a complete range of JEDEC Matrix IC trays and Waffle Packs for a wide variety of components, from stock, eliminating long wait times for components, including BGA, QFN, QFP, PLCC, TSOP, and many others.

Keeping Electronic Component Recovery and Reuse Closer to Home

07/29/2026 | Rob Ronan, Retronix Ltd.
Over the past several years, electronics manufacturers have been forced to rethink what supply chain resilience really means. Shortages, extended lead times, allocation pressures, obsolescence, and price volatility have exposed the limits of a procurement strategy built on the assumption that new components will always be available when needed. However, even when parts can be sourced, they may come with unacceptable lead times, inflated spot-market pricing, or concerns around authenticity and traceability.

Jabil Opens Next-Generation Intelligent Logistics Hub in Penang

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PC Market Runs Low on RAM to Grow: Shipments Decline 4.9% as Memory Crunch Bites

07/08/2026 | IDC
Worldwide PC shipments fell 4.9% year over year in Q2 2026 to 68.2 million units, according to IDC — the first decline after nine consecutive quarters of growth.

Strong AI Demand and Early Consumer Electronics Inventory Build Drive Top 10 Foundries to 3.7% QoQ Revenue Growth in 1Q26

06/12/2026 | TrendForce
TrendForce's latest investigation into the foundry industry reveals that strong shipments of AI HPC chips and related components continued throughout 1Q26.
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