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Innovative and Cost-effective BGA Re-balling

07/23/2024 | Shavi Spinzi, Nano Dimension/Essemtec
A new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.

Daeduck Electronics Developed Large Body FCBGA Substrate for Data Centers

06/26/2024 | BUSINESS WIRE
Established in 1965, Daeduck Electronics holds the distinction of being Korea's pioneering mass-producer of PCBs (Printed Circuit Boards), thus contributing significantly to the advancement of the nation's electronics sector for over six decades.

SMTA Oregon Event Spreads Its Wings

06/25/2024 | Nolan Johnson, I-Connect007
Hillsboro, Oregon is home to the largest Intel campus in the United States as the base of operations for most of Intel’s CPU development. Hillsboro boasts experts and teams in IC and PCB physical layout, packaging, and R&D. Intel and satellite companies in its orbit deliver PCB fabrication and PCB assembly as well. So it's no surprise that SMTA Oregon’s annual meeting takes place practically in the shadows of Intel’s Hillsboro campus.

TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls

06/17/2024 | TopLine

Hentec/RPS to Exhibit Vector Selective Soldering and Odyssey Lead Tinning Systems at IPC APEX EXPO 2024

04/04/2024 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability testing equipment, is pleased to announce it will exhibit its Vector 300 selective soldering and Odyssey 925 lead tinning systems at the upcoming IPC EXPO 2024. 
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