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TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls

06/17/2024 | TopLine

Hentec/RPS to Exhibit Vector Selective Soldering and Odyssey Lead Tinning Systems at IPC APEX EXPO 2024

04/04/2024 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability testing equipment, is pleased to announce it will exhibit its Vector 300 selective soldering and Odyssey 925 lead tinning systems at the upcoming IPC EXPO 2024. 

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Capital Expo & Tech Forum

02/22/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on March 7 at Sweeney Barn in Manassas, Virginia.

Astranis Space Technologies Orders Hentec Industries/RPS Automation Odyssey Component Lead Tinning System

12/13/2023 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Astranis Space Technologies Corp has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine. 

TE Connectivity Orders Hentec Industries/RPS Automation Odyssey 1750 Component Lead Tinning System

11/02/2023 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation is pleased to announce that TE Connectivity has ordered a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning system for installation in their Mount Joy, Pennsylvania facility.
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