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Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands

09/25/2024 | Altus Group
Altus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency.

INSPECTIS’ Extended Reach BGA-XL Stand for Larger PCBAs Joins Higher Magnification XM Lenses

09/23/2024 | INSPECTIS
Ultra-low clearance BGAs on large PCBAs are no problem to optically inspect now, because INSPECTIS’ BGA-XL stand will reach them, while optional new XM lenses will get you under them – offering  up to 285x screen magnification.

Beyond Design: Integrated Circuit to PCB Integration

09/11/2024 | Barry Olney -- Column: Beyond Design
Technologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.

Cost-optimize Your PCB Design and Specifications

08/20/2024 | Erik Pedersen and Richard Koensgen, ICAPE Group
Knowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.

Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle

08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion Laboratory
Current trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.
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