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BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.
Our component salvaging services include BGA’s, QFN’s and LGA’s, BGA re-balling, and reconditioning. All are performed with strict MSD and ESD safeguards. We also offer remarking, bake-out, and packaging in trays, tubes, or tape and reel in accordance with EIA-481 standards. The process involves mechanical disassembly of electronic devices, selective removal of soldered components, reconditioning of leads and pads, laser marking for traceability, and packaging optimized for automated circuit board assembly.
BEST specializes in properly processing and preparing printed circuit boards, ensuring components are safely removed and correctly conditioned for re-insertion into the manufacturing flow. Harvesting components from PCBs helps alleviate shortages of high-value or hard-to-source electronic devices. Our expertise includes reconditioning ball grid arrays, ultra-fine pitch QFPs, QFNs, LGAs, and other electronic packages, providing end-users with confidence in our high-quality reclaiming processes. Our extensive experience in BGA removal, replacement, and reballing makes our salvaging services particularly effective and valuable. With years of industry expertise, we deliver the highest yields while maintaining strict standards of quality and reliability.
In conjunction with our ongoing electronic component reclamation activities, BEST is actively involved with the development of the IPC-7712 Component Reclaim Standard to advance circularity within the electronics manufacturing industry and expand the ability of component reuse as opposed to recycling of electronic waste.
The importance of using high-quality workmanship standards throughout the component reclamation process is essential. This serves to ensure the integrity of the component supply chain, facilitating environmental responsible practices, and reducing reliance on energy intensive fabrication of new electronic components.
