Nolan’s Notes: Tariffs, Technologies, and Optimization
Global Sourcing Spotlight: Finding the Balance Between Cost and Quality
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
When Small Just Isn’t Small Enough; INSPECTIS Launches Micro Size Optical Probe Tip for BGA Inspection
June 3, 2025 | INSPECTISEstimated reading time: 1 minute
The Inspectis BGA inspection system now offers the tiniest optical probe, the Micro Size Optical Probe Tip, for users who feel that they need to get ‘really small’. As BGA packages and their standoffs continue to shrink, viewing under them becomes ever more difficult, making accurate and comprehensive inspection extremely challenging. The Micro Size Optical Probe Tip, however, works like an inverted periscope, viewing the underside of tiny components at a 90-degree angle with an optical probe tip footprint of only 0.4 x 3.5 mm and a width of only 3.5mm.
“The Inspectis BGA inspection system now features the tiniest optical probe with high-resolution optics,” said Alistair Gooch, Marketing Manager. “With its built-in LED lighting, 5.0-megapixel image sensor and high-power background illumination, the Inspectis BGA Inspection System, equipped with the Micro Size Optical Probe Tip, produces high-resolution images of the extremely low-clearance areas beneath BGAs and other tiny packages with as low as 40 microns stand-off.”
Ergonomically designed, the unit is mounted on a compact yet robust stand with an X-Y translation stage for maximum flexibility and configurability. The unique side-view BGA Inspection system features the tiniest and most robust optical probe available with built-in high-power lighting and a crisp, sharp high-resolution 90-degree viewing angle.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Imec’s New GeSi Modulator Hits 400Gb/s, Paving the Way for Next-Gen Optical Interconnects
10/02/2025 | ImecImec – a world-leading research and innovation hub in nanoelectronics and digital technologies – today announced the successful demonstration of a beyond-110GHz C-band GeSi electro-absorption modulator, fabricated on its 300mm silicon photonics platform.
GlobalFoundries, Corning Collaborate to Deliver Detachable Fiber Connector Solutions
09/29/2025 | Globe NewswireGlobalFoundries announced a collaborative effort with Corning Incorporated to develop detachable fiber connector solutions for GF’s silicon photonics platform. Corning’s GlassBridge™ solution, a glass-waveguide based edge-coupler compatible with the platform’s v-grooves, is designed to meet the growing demands of AI datacenters for high bandwidth and power-efficient optical connectivity.
Rigetti, in Collaboration with QphoX, Awarded $5.8M AFRL Contract to Advance Superconducting Quantum Networking
09/29/2025 | RigettiRigetti Computing, Inc., a pioneer in hybrid quantum-classical computing, announced that it was awarded a three-year, $5.8 million contract from the Air Force Research Laboratory (AFRL) to advance superconducting quantum networking.
Vuzix, TCL CSOT Expand Partnership
09/24/2025 | PRNewswireVuzix® Corporation and Augmented Reality (AR) technologies, and TCL China Star Optoelectronics Technology (TCL CSOT), announced a long-term partnership to jointly propel the integration of microLED displays and waveguide optics.
York Space Systems Demonstrates Space-to-Ground Optical Laser Communications Link with Space Development Agency
09/23/2025 | BUSINESS WIREYork Space Systems (York), a defense technology company transforming how the United States builds and operates proliferated space-based capabilities, announced the successful demonstration of a space-to-ground optical laser communication link with the Space Development Agency (SDA).