-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development
December 22, 2023 | Cadence Design SystemsEstimated reading time: 1 minute
Cadence Design Systems, Inc. announced that Wistron, a leading technical service provider (TSP), has adopted and deployed the new AI-driven electromagnetic (EM) in-design analysis workflow, including the Cadence® Optimality™ Intelligent System Explorer and the Cadence Clarity™ 3D Solver, to design a complex 800G network switch. Using the Optimality Explorer’s AI-driven optimization technology and the Clarity 3D Solver for fast, accurate and scalable EM in-design analysis, Wistron was able to analyze large volumes of data—improving overall design reliability while realizing a 2X improvement in turnaround time (TAT).
Legacy 3D solvers typically deliver slower simulation results due to excessive run times and memory usage. In contrast, the Clarity 3D Solver, with its distributed multiprocessing technology and virtually unlimited capacity, quickly analyzes large and complex PCB, IC packaging and complete systems without compromising accuracy. Its exceptional performance is further fueled by the Optimality Explorer, a generative AI-driven, in-design multiphysics system analysis and optimization solution that allows design engineers to explore 3D EM and high-speed signal and power integrity results efficiently and effectively. By revealing design configurations that may not be manually achievable, the Optimality Explorer streamlines design iterations—resulting in shorter and more efficient design cycles.
“By adopting Cadence’s AI-driven optimization solution including Optimality Explorer alongside the Clarity 3D Solver for our 800G network switch and GPU server, we leveraged the design of experiments model to explore multiple simulations quickly and realized far more robust designs with a 2X improvement in TAT,” said Christopher Huang, vice president of the Enterprise and Networking Business Group at Wistron. “With a shift left of AI-enabled multiphysics systems analysis into our electronic design workflow, we are not only improving product performance but gaining valuable design insight and engineering efficiencies.”
“As high-speed electronic systems continue to grow in complexity to meet market demands, Cadence is committed to developing software solutions that address multiphysics challenges and the associated scaling demands,” said Ben Gu, corporate vice president of the Multiphysics System Analysis Group at Cadence. “Wistron has embraced the Cadence multiphysics system analysis portfolio to expedite design throughput and engineering turnaround time. The Clarity and Optimality solutions, coupled with HPC, are the trifecta for next-generation design success.”
The Clarity 3D Solver and the Optimality Explorer support Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
Suggested Items
One Partial HDI Technique: mSAP
11/05/2024 | Andy Shaughnessy, Design007 MagazineChris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.
SIA Commends Selections for CHIPS R&D Flagship Facilities
11/04/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.
Siemens, CELUS Collaborate to Empower SMBs with AI-powered PCB Design
10/30/2024 | SiemensSiemens Digital Industries Software, a global leader in PCB electronic systems design, and CELUS, a pioneer in AI-powered electronic design automation solutions, announced their collaboration to transform the PCB design landscape for small and medium-sized businesses (SMBs) and independent engineers.
TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems
10/28/2024 | ANSYSAnsys was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems.
EMA Presents Webinar on Designing the Perfect Stackup for Flex
10/25/2024 | EMA Design AutomationJoin the experts at Newgrange Design and EMA to make sure you set your next flex project up for success from the beginning in latest webinar.