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One Partial HDI Technique: mSAP 

11/05/2024 | Andy Shaughnessy, Design007 Magazine
Chris Hunrath, vice president of technology at Insulectro, believes that mSAP just might be the trick for designers considering partial HDI. As Chris explains, the materials and equipment required for the mSAP process are easily available, and the process is well established. This could be a great option for designers working with BGAs that have a pitch of 0.5 mm or less.

SIA Commends Selections for CHIPS R&D Flagship Facilities

11/04/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.

Siemens, CELUS Collaborate to Empower SMBs with AI-powered PCB Design

10/30/2024 | Siemens
Siemens Digital Industries Software, a global leader in PCB electronic systems design, and CELUS, a pioneer in AI-powered electronic design automation solutions, announced their collaboration to transform the PCB design landscape for small and medium-sized businesses (SMBs) and independent engineers.

TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

10/28/2024 | ANSYS
Ansys was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems.

EMA Presents Webinar on Designing the Perfect Stackup for Flex

10/25/2024 | EMA Design Automation
Join the experts at Newgrange Design and EMA to make sure you set your next flex project up for success from the beginning in latest webinar.
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