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Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle

08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion Laboratory
Current trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.

IDTechEx Asks if Silicon Anodes Are the Key to Mass EV Adoption

05/24/2024 | PRNewswire
Maximizing energy density has been one key area of focus in electric vehicle battery development. Optimizations in cell and battery pack designs, alongside the use of higher nickel NMC and NCA cathodes, have led to steady improvement in battery energy density over the past 10-15 years.

High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership

05/20/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member. 

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/15/2024 | Andy Shaughnessy, Design007 Magazine
It was a busy week in PCB design and manufacturing. This has been a pretty “dense” week, and this week’s Top Five features an article on density equations by Happy Holden, and a news item about the SMTA UHDI symposium in Phoenix. We also have news about our latest podcast, and a Chris Mitchell column about economic security here and abroad. And Todd Kolmodin discusses the ins and out of 4-wire Kelvin testing, and he tells us a little about Lord Kelvin himself. 

Happy’s Tech Talk #26: Balancing the Density Equation

03/14/2024 | Happy Holden -- Column: Happy’s Tech Talk
Printed circuit design and layout is a creative process that has profound implications for electronic products. With the need for more parts on an assembly, or the trend to make things smaller to be portable or for faster speeds, the design process is a challenging one. The process is one of “balancing the density equation” (Figure 1) with considerations for certain boundary conditions like electrical and thermal performance. Unfortunately, many designers do not realize that there is a mathematical process to the layout of a printed circuit
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