The New Chapter: I’ve Found My ‘Why’
Dan’s Biz Bookshelf: 'The Song of Significance: A New Manifesto for Teams'
It’s Only Common Sense: Innovative Sales Strategies for SuccessHDPUG: 30 Years of Collaboration
January 1, 2024 | Madan Jagernauth, Marketing Directory HDPEstimated reading time: Less than a minute
The High Density Packaging User Group International Inc. (HDP) and IPC have partnered successfully for many years. The groups signed an MoU in 2020 to strengthen this relationship, increase technical collaboration between the groups, and provide a mutual path toward emerging and disruptive high-density interconnect (HDI) technologies.
What is HDP?
HDP, founded in 1993, is a nonprofit trade organization that offers memberships to companies involved in the electronics manufacturing industry. HDP's mission is to drive innovations in the electronics industry, reducing cost and time to market through active collaborations that solve critical and emerging problems. HDP is focused on the characterization and reliability of electronic assemblies and sub-assemblies, focusing on new technologies.
This article originally appeared in the fall 2023 issue of IPC Community. To learn more about HDP’s area of focus and process, click here.
Share on:
Suggested Items
IDTechEx Asks if Silicon Anodes Are the Key to Mass EV Adoption
05/24/2024 | PRNewswireMaximizing energy density has been one key area of focus in electric vehicle battery development. Optimizations in cell and battery pack designs, alongside the use of higher nickel NMC and NCA cathodes, have led to steady improvement in battery energy density over the past 10-15 years.
High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
05/20/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/15/2024 | Andy Shaughnessy, Design007 MagazineIt was a busy week in PCB design and manufacturing. This has been a pretty “dense” week, and this week’s Top Five features an article on density equations by Happy Holden, and a news item about the SMTA UHDI symposium in Phoenix. We also have news about our latest podcast, and a Chris Mitchell column about economic security here and abroad. And Todd Kolmodin discusses the ins and out of 4-wire Kelvin testing, and he tells us a little about Lord Kelvin himself.
Happy’s Tech Talk #26: Balancing the Density Equation
03/14/2024 | Happy Holden -- Column: Happy’s Tech TalkPrinted circuit design and layout is a creative process that has profound implications for electronic products. With the need for more parts on an assembly, or the trend to make things smaller to be portable or for faster speeds, the design process is a challenging one. The process is one of “balancing the density equation” (Figure 1) with considerations for certain boundary conditions like electrical and thermal performance. Unfortunately, many designers do not realize that there is a mathematical process to the layout of a printed circuit
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms
03/12/2024 | JCN NewswireTANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE™ low-temperature fired paste for gold-to-gold bonding.