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Suggested Items

Beyond Recycling: A Circularity Approach for a Truly Resilient Electronics Supply Chain

07/23/2026 | Marcy LaRont, I-Connect007
Dr. Diana Radovan, director of sustainability policy and sustainability advocacy lead at the Global Electronics Association, has been at the center of some of the electronics industry's most consequential policy discussions, from the European Parliament in Brussels to sustainability summits in Germany and circularity conferences across Europe. With the European Union's landmark Circular Economy Act moving closer to reality and updates to PFAS regulations, she has been ensuring that the voice of the electronics industry is heard. In this interview, she discusses what's coming, why it matters, why true circularity extends far beyond recycling, and what policymakers still need to do to enable it.

Elementary, Mr. Watson: The Display Revolution, Now With Fewer Tiny Keys

07/23/2026 | John Watson -- Column: Elementary, Mr. Watson
From the earliest days of electronics, engineers have worked within some shared assumptions about how systems should be built and how people should interact with them. These assumptions often feel so natural that they are rarely questioned; they define what "normal" is. Thomas Kuhn, the American philosopher of science best known for introducing the idea of "technical paradigm shifts," observed, "What someone sees depends upon what he looks at and also upon what his previous visual-conceptual experience has taught him to see." In other words, we do not readily notice the framework we are in while using it, nor how it relates to the broader picture of innovation.

DFM Mistakes Designers Make When Moving to ELIC

07/20/2026 | Anaya Vardya, American Standard Circuits
The transition from HDI to every layer interconnect (ELIC) is where the DFM gap between design intent and fabrication reality is most visible. Several common misconceptions appear consistently in the data packages we review at ASC. The most common ELIC design mistake mirrors what we generally see in first-time UHDI builds: using process minimums everywhere because they appear on a capability chart. In ELIC, this is especially consequential. If only one region truly requires aggressive geometry, say, a fine-pitch BGA escape, the rest of the design should preserve margin. Relaxing non-critical areas makes the overall build more manufacturable without sacrificing the dense region that drives the stackup.

The AI Data Center Boom: Technology, Capacity, and Society

07/17/2026 | Marcy LaRont, I-Connect007
AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.

Marcy’s Musings: From Business Diversification to Designing Display Electronics

07/16/2026 | Marcy LaRont -- Column: Marcy's Musings
I love this time of year. Aside from summer, I appreciate the natural pause from the busyness of trade shows, conferences, airport delays, and back-to-back Teams meetings. Colleagues become a bit harder to reach as family vacations are prioritized, and we take focus off work for a little while. But no matter the season, the accelerated pace of technological advancement doesn’t actually slow down. In this issue, we use this pause to look inward and forward.
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