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IPC Standards and Electronics Sustainability: More Than Meets the Eye
January 5, 2024 | Kelly Scanlon, IPC Lead Sustainability StrategistEstimated reading time: 1 minute
When we look at existing IPC standards, we see that most were created and intended to communicate and clarify expectations for superior quality, reliability, and consistency in electronics manufacturing. At first glance, their connection to sustainability is not obvious.
Yet as we continue to evaluate existing IPC standards against sustainability reporting best practices or requirements for companies in the electronics value chain, there are more than a dozen IPC standards that address important and relevant sustainability topics.
For example, training and education—a relevant and important industry sustainability topic covered by GRI standards—is represented in popular IPC standards, including IPC-A-610, Acceptability of Electronic Assemblies; IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies; and IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies; and the certification programs built around these standards.
The GRI (Global Reporting Initiative) standards focus on the environmental, social, and economic impacts of a company in relation to sustainable development. They represent global best practices for reporting publicly. GRI is just one of four frameworks sustainability disclosures identified as a driver causing companies in the industry to disclose data and information on various sustainability topics and targets. A recent exploratory materiality study of dozens of industry sustainability reports revealed that GRI, along with SASB, TCFD, and CDP, was strongly preferred and most used of the four.
To read the rest of this article, which appeared in the fall issue of IPC Community, click here.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.