Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
Indium Expert to Present at Power Device & Module Expo at NEPCON Japan
January 5, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24 in Tokyo. The presentation will explore trends in EV power electronics and the interconnect materials that enable them.
Interconnect materials play a major role in the efficiency and reliability of power electronics. The adoption of state-of-the-art wide bandgap die technologies such as SiC and GaN, require complementary die-attach materials to maximize the benefits. Higher power densities require new strategies for thermal management and heat dissipation. Packaging trends such as transfer molded modules and the direct bonding to heat-sinks and coolers is an area where different material and process options are considered, each with pros and cons for addressing the challenges of this application.
“As the world moves toward a greener, more sustainable future, the automotive industry is at the forefront of this transformation. EVs have emerged as a key solution for tacking carbon emissions which contribute to climate change, and at the heart of every electric vehicle are power electronics,” said Chou. “In this presentation, I will cover breakthroughs and trends that are shaping the power electronics landscape, especially for EVs.”
As senior area technical manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
Share on:
Suggested Items
Maxar Awarded Contract by NGA to Deliver Ai-Powered Object Detection Services
07/01/2025 | MaxarMaxar Intelligence, the leading provider of secure, precise geospatial insights, announced that it was awarded Delivery Order 01 under the Luno A program by the National Geospatial-Intelligence Agency (NGA).
Empower Appoints Steve Hertog as Senior Vice President of Sales to Strengthen Next Phase of High Growth
07/01/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in integrated voltage regulators (IVRs), announced the appointment of Steve Hertog as Senior Vice President of Sales. In this role,
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
Cadence AI Autorouter May Transform the Landscape
06/19/2025 | Andy Shaughnessy, Design007 MagazinePatrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?
Nordic Semiconductor Accelerates Edge AI Leadership with Acquisition of Neuton.AI
06/18/2025 | PRNewswireNordic Semiconductor, the global leader in ultra-low-power wireless connectivity solutions, today announced its acquisition of the intellectual property and core technology assets of Neuton.AI, a pioneer in fully automated TinyML solutions for edge devices.