Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Indium Expert to Present at Power Device & Module Expo at NEPCON Japan
January 5, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Senior Area Technical Manager Jason Chou is set to deliver a presentation at the Power Device & Module Expo, held in conjunction with NEPCON Japan, on January 24 in Tokyo. The presentation will explore trends in EV power electronics and the interconnect materials that enable them.
Interconnect materials play a major role in the efficiency and reliability of power electronics. The adoption of state-of-the-art wide bandgap die technologies such as SiC and GaN, require complementary die-attach materials to maximize the benefits. Higher power densities require new strategies for thermal management and heat dissipation. Packaging trends such as transfer molded modules and the direct bonding to heat-sinks and coolers is an area where different material and process options are considered, each with pros and cons for addressing the challenges of this application.
“As the world moves toward a greener, more sustainable future, the automotive industry is at the forefront of this transformation. EVs have emerged as a key solution for tacking carbon emissions which contribute to climate change, and at the heart of every electric vehicle are power electronics,” said Chou. “In this presentation, I will cover breakthroughs and trends that are shaping the power electronics landscape, especially for EVs.”
As senior area technical manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
Zhen Ding Technology Highlights AI-Driven Transformation of the PCB Industry at SEMICON Taiwan 2025
09/11/2025 | Zhen Ding TechnologyArtificial intelligence (AI) is expanding rapidly, with almost no field left untouched by the wave of computing power-driven transformation.
Hitachi Unveils $1B U.S. Investment in Critical Grid Infrastructure
09/05/2025 | Hitachi EnergyHitachi Energy, a wholly owned subsidiary of Hitachi, Ltd., and global leader in electrification, today announced a historic investment of more than $1 billion USD to expand the production of critical electrical grid infrastructure in the United States.
Wisdom From Data-center Power Pioneer Mike Mosman
09/02/2025 | Barry Matties, I-Connect007Few engineers have moved the levers of modern electronics more decisively than Mike Mosman. From the pre-email computer rooms of the 1980s to today’s hyperscale campuses cranking out AI cycles, the retired power engineer and co-founder of CCG Facilities Integration has spent four decades proving that uptime is a design discipline, not a hope.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/04/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.