Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
IPC to Host 3rd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Events in South Asia
January 10, 2024 | IPCEstimated reading time: 2 minutes
IPC India will host the third annual Integrated Electronics Manufacturing & Interconnections (IEMI), the largest industry networking event in South Asia for the electronics industry, to be held in Penang, Malaysia, and Bangalore, India.
Malaysia is India’s third largest trading partner in the Association of Southeast Asian Nations (ASEAN), and India is the largest trading partner for Malaysia in South Asia. The bilateral trade between India and Malaysia in 2023 reached 20 billion dollars and is expected to increase to 25 billion dollars in the next three years. Malaysia hosts the second-largest Indian community in the world. There is growing engagement in all aspects of the bilateral relationship and IPC sees semiconductor and electronics manufacturing as key areas for potential collaboration.
IEMI events are focused on bringing together players in the electronics industry – OEMs, EMS, PCB manufacturers, cable and wire harness manufacturers, advanced packaging and semiconductor companies, and electronics industry suppliers. Vertical market OEMs from aerospace, defense, automotive, medical, industrial automation, railways and telecom will participate in the event. IEMI offers strategic alliances, export leads, business partnerships, investment promotion, source products and services, and an opportunity to gain technical knowledge. Pre-event activities start in January 2024 at various locations in India and other countries.
Key features of the IEMI events include product displays, presentations by industry leaders, panel discussions, a vendor development program, business matchmaking meetings with international delegates, standards development sessions, awards program, hand soldering competitions, and a world wire harness competition.
As the biggest industry networking event in South Asia for the electronics industry, IEMI 2024 is expected to significantly contribute to the sector's progress with themes like “advanced packaging of semiconductors” for IEMI 2024 Penang, Malaysia and “defence and aerospace” for IEMI 2024, Bangalore, India. The Penang event is organized in conjunction with Electronics Manufacturing Expo Asia – the largest electronics show in Malaysia attracting more than 8,000 visitors.
“IPC has participated in the India and Malaysia electronics manufacturing market for many years, and we have observed significant certification growth recently,” said John Mitchell, IPC president and CEO. “India and Malaysia are dynamic markets for the global electronics manufacturing industry, and IEMI 2024 provides opportunities for members to expand their business and supply chain.”
“IEMI 2023 events in India achieved great positive feedback from the industry. We hosted more than 1,000 attendees from more than 10 countries, 200 business-to-business meetings, and 10 additional educational/networking activities. The success of IEMI events lies with the audience profile, eminent industry speakers, sponsors and exhibitors and we are committed to the growth of IEMI 2024,” said Gaurab Majumdar, executive director of IPC’s regional office in India.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.