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Gen3 to Release Next Generation CM Series Contaminometer in Q1 2024
January 10, 2024 | Gen3 SystemsEstimated reading time: 1 minute
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, proudly introduces the revolutionary CM Series Contaminometer, set to be available from the first quarter of 2024. This new Process Ionic Contamination Tester boasts an array of groundbreaking features designed to elevate user experience and provide unparalleled measurement capabilities.
The new CM Series comes equipped with brand-new software featuring a redesigned user interface, ensuring a seamless and enhanced user experience. With an accelerated testing cycle completing within a remarkable 3 minutes, the system offers efficiency without compromising accuracy. The redesigned hardware optimizes measurement capability, delivering better accuracy and stability.
This state-of-the-art Contaminometer is Six-Sigma (6σ) verified as a process control tool, making it a globally recognized standard for achieving objective evidence. Redesigned analysis tools enable easy cross-referencing with library data, enhancing traceability features for tracking board history. The system is equipped with automatic temperature and CO2 compensation, ensuring precise measurements in accordance with the latest international standards.
Gen3's CM Series, the world's first combined ROSE (Resistivity of Solvent Extract) and Process Ionic Contamination Tester (PICT), has received global acclaim and recognition. Available in five different models and tank sizes, the CM Series offers versatility for various circuit assembly testing needs.
The newly launched CM Series will be showcased at the upcoming Southern Manufacturing Show at Farnborough International Exhibition Centre from the 6th – 8th February. Pop by stand C100 and see the latest in Gen3’s product line.
Additional content from Gen3:
The Printed Circuit Assembler’s Guide to… Process Control by Graham K. Naisbitt, Dr. Chris Hunt
The Printed Circuit Assembler’s Guide to… Process Validation by Graham K. Naisbitt
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Rachael Temple - AlltematedSuggested Items
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The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.