Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Wiley Launches Interoperable Platform to Power Scientific Discovery in World's Leading AI Technologies

10/14/2025 | BUSINESS WIRE
Wiley, a global leader in authoritative content and research intelligence, announced the launch of Wiley AI Gateway, the industry's first AI-native research intelligence platform that provides researchers access to trusted content from world-leading scholarly publishers through a single endpoint.

Benchmark Completes Key Role in U.S. Manufacturing and Testing for Intel’s Aurora Exascale Supercomputer

07/24/2025 | BUSINESS WIRE
Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced the successful commissioning and validation of the Aurora exascale supercomputer at Argonne National Laboratory

Scanfil Suzhou Factory Receives Sustainability Award from Thermo Fisher Scientific

12/16/2024 | Scanfil
Thermo Fisher Scientific granted a Sustainability Award to Scanfil’s Suzhou factory at the APAC Sustainability Summit. This accolade highlights Suzhou’s dedication to sustainable practices.

IPC, FED Partner for New Design Conference in Vienna

12/12/2024 | Andy Shaughnessy, Design007 Magazine
IPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?

Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science

04/16/2024 | BUSINESS WIRE
Leaders in high performance computing in the U.S. and Japan have signed a memorandum of understanding (MOU) establishing a cooperative relationship in support of artificial intelligence (AI) computing projects.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in