Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

TACC Limited, NUS I-FIM Sign MOU to Advance Next-Generation Materials

06/02/2026 | PRNewswire
TACC Limited, an LNJ Bhilwara Group company and wholly owned subsidiary of HEG Limited, has signed a Memorandum of Understanding (MOU) with the Institute for Functional Intelligent Materials (I-FIM) at the National University of Singapore (NUS) to collaborate in the fields of advanced materials science, nanotechnology, and related disciplines.

Teledyne to Supply Detectors for Lazuli Space Observatory

03/30/2026 | BUSINESS WIRE
Teledyne Space Imaging, part of Teledyne Technologies Incorporated has been awarded a contract by Schmidt Sciences to deliver advanced near-infrared (NIR) H4RG-10 flight focal plane arrays (FPAs) and custom electronics for integration into the Integral Field Spectrograph on the groundbreaking Lazuli Space Observatory.

MicroCare Appoints Uwe Wanner as Director of Research & Development

03/16/2026 | MicroCare, LLC
MicroCare announces the appointment of Dr. Uwe Wanner, MBA, as Director of Research & Development. In this role, Wanner will lead the company’s global R&D strategy, advancing innovation, regulatory excellence, and product development to support continued growth in precision cleaning and fluid technology solutions.

Teledyne Acquires DD-Scientific

01/15/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated announced the acquisition of DD-Scientific Holdings Limited and its subsidiary DD-Scientific Limited. DD-Scientific, founded in 2011 and headquartered in Fareham, United Kingdom, develops and manufactures high-performance gas sensors for critical applications in industries that demand absolute accuracy.

Pan-European Electronics Design Conference Returns to Prague in January

12/31/2025 | Global Electronics Association
The Pan-European Electronics Design Conference is jointly hosted and organized by the Electronics Design and Manufacturing Association (FED) and the Global Electronics Association – two associations representing more than 3,700 companies from the electronics industry.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in