-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Yamaha Looks Under the Hood of Cutting-edge Software Tools at Industry Technical Forum
January 23, 2024 | Yamaha Robotics SMT SectionEstimated reading time: 1 minute
Yamaha Robotics SMT Section has released new YSUP smart factory software with automatic troubleshooting, and previewed the advanced functionality to Productronica visitors during the Munich event’s technical program in November.
Presenting at the Productronica Forum, Yamaha’s Kamil Stasiak, SMT Section product marketing manager, described in-depth the new YSUP Analytics Dashboard that quickly identifies the causes of any assembly defects. The new functionality increases production efficiency and enables every shift to achieve consistent productivity by relieving reliance on the production team’s diagnostic skills.
Operating continuously while assembly is ongoing, the auto-analytical functionality works with data from inline inspection systems and generates clear instructions for operators to take remedial action. The system also displays the effects of improvements on the YSUP Dashboard monitor to keep production teams always up to speed with progress. The underlying platform is based on statistical techniques and allows scaling to add further analytics tools.
The Forum audience learned how the software identifies probable causes of recorded exceptions in near real-time using analytical methods including flow judgement, error-code diagnostics, health-check data diagnostics, and image-recognition diagnostics. Its capabilities include automatic pickup error analysis, which lets production staff view the time and circumstances of any pickup errors, see the exact location, and view corrective actions.
The new Dashboard is fully integrated in Yamaha’s YSUP intelligent factory software, which provides production support tools for planning, implementing, measuring, and improving manufacturing on surface-mount production lines. The tools include applications for scheduling production, creating work orders, programming inline equipment, managing components, monitoring production status, ensuring traceability, predicting results, and reviewing workflows.
Among several new features added in recent software releases, YSUP-MI enhances management of materials on assembly lines and YSUP-LINK connects production equipment with enterprise systems using industry-standard protocols. Also, YSUP-OC operation control generates work instructions, handles warnings and error notifications, and helps operators sort and prioritise their tasks.
The unifying GUI ensures intuitive operation with easy access to settings and production status information expressed in clear charts and graphics. The YSUP Dashboard, now with auto analytics as explained in depth at the Productronica Forum, also features pickup analysis, accuracy analysis, print analysis, and real-time production monitoring.
The new YSUP Dashboard with automatic analytics takes users straight to the root causes of defects identified by inline inspection.
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Kitron Signs Contract for Marine IoT Technology
12/23/2024 | KitronKitron has entered into a manufacturing contract with a leading technology company focusing on innovative IoT solutions.
High-Generation Panel Production Expected to Drive OLED Notebook Penetration Rate Past 5% by 2027
12/20/2024 | TrendForceTrendForce's latest OLED Technology and Market Development Report reveals that the penetration rate of OLED displays in notebooks is set to increase to 3% in 2024, driven by large-scale procurement from Chinese laptop brands. While growth in 2025 is expected to be moderate, the anticipated introduction of OLED displays in Apple’s MacBook lineup will mark a significant turning point.
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
12/17/2024 | ACCESSWIREToray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.