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IPC APEX EXPO 2024 Offers More Than 100 Technical Sessions in Electronics Manufacturing
January 23, 2024 | IPCEstimated reading time: 2 minutes
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO 2024, features cutting-edge technical content directly influencing the $2 trillion global electronics manufacturing industry. Attendees will have more than 100 opportunities to update their technical knowledge during sessions at IPC APEX EXPO 2024 from April 6-11, 2024, in Anaheim, Calif.
“Our technical conference and professional educational program feature the highest quality technical content from technical experts representing three continents,” said Julia Gumminger, IPC manager, professional development and events. “Industry experts representing global enterprises and small companies will present novel, unpublished data and share their innovations in a wide range of fundamental and emerging topics.”
Unique to 2024, IPC APEX EXPO will host the Electronic Circuits World Convention (ECWC16) Technical Conference, an expanded, global technical symposium featuring more than 70 presentations over nine technical tracks: PCB Fabrication and Materials; Design; Assembly Process and Materials; HDI uHDI and Substrates; Sustainability for Electronics; High Reliability; Factory of the Future; Emerging Technologies; and Quality, Reliability, Test and Inspection.
Authors from around the globe will present their new, unpublished results, to share developments and innovations in materials, techniques, processes across the spectrum of the electronics manufacturing supply chain. Two special technical sessions will feature invited speakers on advanced packaging and e-mobility and EV automotive. The technical conference will be held April 9-11.
IPC APEX EXPO 2024 will provide more than 30 professional development course sessions delivered by technical experts, corporate technologists, and peer leaders in the industry. The professional development courses, covering such topics as artificial intelligence, PWB design engineering, 3-D printing, Li-ion battery technology, and proactive design methods for approaching zero-field failures, will provide attendees the opportunity to build their professional and technical skills and increase their knowledge in techniques, materials, and trends in all aspects of the industry. Professional development courses will be held April 7-8, and April 11.
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Sweeney Ng - CEE PCBSuggested Items
Punching Out: How Are the Big Boys in Electronics Doing?
05/12/2026 | Tom Kastner -- Column: Punching Out!Let’s see what the public companies are up to in the PCB and EMS industries. In North America, there are only a couple of publicly traded PCB companies: TTM Technologies and Firan Technology Group. On the EMS side, there are a few more: Flex, Jabil, Celestica, Sanmina,, Benchmark, Fabrinet, Kimball Electronics, Plexus Corp, Nortech Systems, and Key Tronic Corp. From an M&A standpoint, these public companies have been fairly quiet in the past five years. FTG completed two deals in 2022 (IMI and Holaday), Flex had three deals, Jabil had five deals, and Sanmina had one deal.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.